A module includes a substrate including a first surface, a first component mounted on the first surface, at least a part of a surface of which on a side distant from the substrate is covered with a first conductive film, a sealing resin arranged to cover the first surface and the first component, and a shield film that covers at least a part of a surface of the sealing resin on the side distant from the substrate. The shield film includes a first shield portion superimposed on at least a part of the first conductive film and a second shield portion. The first shield portion is isolated from the second shield portion by a groove that divides the shield film and is provided to such a depth as entering the sealing resin. The first shield portion is electrically independent.