Hot melt processable composition mixtures include an acid-functional (meth)acrylate-based adhesive composition and a zinc di-(meth)acrylate salt. The adhesive composition has a hot melt processing temperature, and the zinc salt has a melting point that is higher than the hot melt processing temperature of the adhesive composition. The mixture is hot melt processable, and upon application to a substrate, the mixture forms an ionically crosslinked layer with thermally reversable ionic crosslinks.