Invention Publication
- Patent Title: SOFTWARE APPLICATION BUILD TESTING
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Application No.: US17545596Application Date: 2021-12-08
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Publication No.: US20230176961A1Publication Date: 2023-06-08
- Inventor: Jingun Hong , Dong Won Hwang
- Applicant: SAP SE
- Applicant Address: DE Walldorf
- Assignee: SAP SE
- Current Assignee: SAP SE
- Current Assignee Address: DE Walldorf
- Main IPC: G06F11/36
- IPC: G06F11/36 ; G06F8/71

Abstract:
Various examples are directed to systems and methods for testing software. A testing system may use test case data describing a first test case failed by a first build of the software application, the first build generated by a first commit operation of the plurality of commit operations to execute a fault localization operation, the fault localization operation to identify a first suspect program element of a first build. The testing system may use the first suspect program element and commit data to select a second commit operation from the plurality of commit operations. The testing system may determine an error-inducing commit operation from the plurality of commit operations and executing a corrective action.
Public/Granted literature
- US11768761B2 Software application build testing Public/Granted day:2023-09-26
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