Invention Publication

  • Patent Title: SOFTWARE APPLICATION BUILD TESTING
  • Application No.: US17545596
    Application Date: 2021-12-08
  • Publication No.: US20230176961A1
    Publication Date: 2023-06-08
  • Inventor: Jingun HongDong Won Hwang
  • Applicant: SAP SE
  • Applicant Address: DE Walldorf
  • Assignee: SAP SE
  • Current Assignee: SAP SE
  • Current Assignee Address: DE Walldorf
  • Main IPC: G06F11/36
  • IPC: G06F11/36 G06F8/71
SOFTWARE APPLICATION BUILD TESTING
Abstract:
Various examples are directed to systems and methods for testing software. A testing system may use test case data describing a first test case failed by a first build of the software application, the first build generated by a first commit operation of the plurality of commit operations to execute a fault localization operation, the fault localization operation to identify a first suspect program element of a first build. The testing system may use the first suspect program element and commit data to select a second commit operation from the plurality of commit operations. The testing system may determine an error-inducing commit operation from the plurality of commit operations and executing a corrective action.
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