Invention Publication
- Patent Title: ELECTROSPUN MATERIAL COVERED APPLIANCES AND METHODS OF MANUFACTURE
-
Application No.: US18068181Application Date: 2022-12-19
-
Publication No.: US20230191005A1Publication Date: 2023-06-22
- Inventor: John William Hall , Bart Dolmatch , Zeke Eller , Robert S. Kellar , Rachel Lynn Simmons , Wayne L. Mower
- Applicant: Merit Medical Systems, Inc.
- Applicant Address: US UT South Jordan
- Assignee: Merit Medical Systems, Inc.
- Current Assignee: Merit Medical Systems, Inc.
- Current Assignee Address: US UT South Jordan
- Main IPC: A61L31/14
- IPC: A61L31/14 ; A61L31/04 ; A61K9/70 ; D01D5/00 ; D01F6/12 ; A61L27/16 ; A61L27/34 ; A61L27/56 ; A61L31/10 ; D04H1/728 ; D04H3/073 ; A61F2/82 ; B05D1/00
Abstract:
A medical appliance or prosthesis may comprise one or more layers of electrospun nanofibers, including electrospun polymers. The electrospun material may comprise layers including layers of polytetrafluoroethylene (PTFE). Electrospun nanofiber mats of certain porosities may permit tissue ingrowth into or attachment to the prosthesis.
Information query
