Invention Application
- Patent Title: OLIGOMER, COMPOSITION, PACKAGING STRUCTURE, AND METHOD OF DISASSEMBLING PACKAGING STRUCTURE
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Application No.: US17578080Application Date: 2022-01-18
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Publication No.: US20230117528A1Publication Date: 2023-04-20
- Inventor: Chi-Fu TSENG , Jauder JENG , Tien-Shou SHIEH , Chin-Hui CHOU
- Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Applicant Address: TW Hsinchu
- Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee Address: TW Hsinchu
- Priority: TW110138097 20211014
- Main IPC: C08G63/78
- IPC: C08G63/78
Abstract:
An oligomer is formed by reacting a diacid monomer with (a) epoxy resin or (b) glycidyl methacrylate, wherein the diacid monomer has a chemical structure of wherein X is —O—, and each R1 is independently CH3, CH2F, CHF2, or CF3. A composition containing the oligomer can be cured to serve as a sealant of an optoelectronic device, and the sealant can be lifted off by a laser beam irradiation.
Public/Granted literature
- US11753502B2 Oligomer, composition, packaging structure, and method of disassembling packaging structure Public/Granted day:2023-09-12
Information query
