Invention Application
- Patent Title: SUPPORTING BACKPLANE, MANUFACTURING METHOD THEREFOR AND BACKPLANE
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Application No.: US17043937Application Date: 2019-10-31
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Publication No.: US20230131247A1Publication Date: 2023-04-27
- Inventor: Zhiwei LIANG , Wenqian LUO , Zhijun LV , Yingwei LIU , Ke WANG , Zhanfeng CAO
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- International Application: PCT/CN2019/114767 WO 20191031
- Main IPC: H01L33/62
- IPC: H01L33/62 ; H01L23/00

Abstract:
The present disclosure provides a supporting substrate, including: a base substrate and a plurality of connecting electrodes provided on the base substrate, wherein a clamping electrode is provided on a side of at least one of the connecting electrodes facing away the base substrate, the clamping electrode is electrically connected with a corresponding connecting electrode and configured to be capable of clamping and fixing an electrode pin of the micro-light emitting device. The present disclosure also provides a manufacturing method for the supporting substrate, and a backplane.
Public/Granted literature
- US12087892B2 Supporting backplane, manufacturing method therefor and backplane Public/Granted day:2024-09-10
Information query
IPC分类: