Invention Publication
- Patent Title: OPTOELECTRONIC CHIP
-
Application No.: US18270157Application Date: 2021-09-30
-
Publication No.: US20240060897A1Publication Date: 2024-02-22
- Inventor: Pierre Türschmann , Daniel Böning
- Applicant: INTERHERENCE GMBH
- Applicant Address: DE Erlangen
- Assignee: INTERHERENCE GMBH
- Current Assignee: INTERHERENCE GMBH
- Current Assignee Address: DE Erlangen
- Priority: DE 2021112251.1 2021.05.11 DE 2021112256.2 2021.05.11 DE 2020135024.4 2021.12.30
- International Application: PCT/EP2021/076977 2021.09.30
- Date entered country: 2023-06-28
- Main IPC: G01N21/64
- IPC: G01N21/64 ; G02B21/06 ; G02B21/30 ; G02B21/16 ; G01N33/557
Abstract:
The present invention relates to an optoelectronic chip for receiving a sample in the visualization of temperature-dependent processes, having a carrier layer, a thin-film lightguide and a thin-film heating element, wherein the thin-film lightguide and the thin-film heating element are preferably arranged on sides of the carrier layer that lie opposite each other.
Information query
