公开(公告)号：US20240069317A1

公开(公告)日：2024-02-29

申请号：US18270163

申请日：2021-09-30

Applicant: INTERHERENCE GMBH

Inventor： Pierre Türschmann ,  Daniel Böning

IPC: G02B21/16 ,  G01N21/64 ,  G02B21/30

CPC classification number: G02B21/16 ,  G01N21/6458 ,  G01N21/648 ,  G02B21/30 ,  G01N21/6486

Abstract: The present invention relates to an optoelectronic chip for receiving a sample for optical examination, having a carrier layer, a thin-film lightguide having an active region, in which the sample interacts with a guided mode of the thin-film lightguide, wherein at least one scattering structure is arranged in the active region, which scatters a part of the light guided in the thin-film lightguide, whereby a reference light field is produced. The invention further relates to an optical system having such a chip. The system is used for the marker-free analysis of particles, particularly biomolecules in their natural environment.

公开(公告)号：US20240060897A1

公开(公告)日：2024-02-22

申请号：US18270157

申请日：2021-09-30

Applicant: INTERHERENCE GMBH

Inventor： Pierre Türschmann ,  Daniel Böning

IPC: G01N21/64 ,  G02B21/06 ,  G02B21/30 ,  G02B21/16 ,  G01N33/557

CPC classification number: G01N21/6458 ,  G02B21/06 ,  G02B21/30 ,  G02B21/16 ,  G01N21/6428 ,  G01N33/557 ,  G01N2201/0231 ,  G01N2201/08

Abstract: The present invention relates to an optoelectronic chip for receiving a sample in the visualization of temperature-dependent processes, having a carrier layer, a thin-film lightguide and a thin-film heating element, wherein the thin-film lightguide and the thin-film heating element are preferably arranged on sides of the carrier layer that lie opposite each other.