Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a conductive pad having a first surface, an opposing second surface, and lateral surfaces extending between the first and second surfaces; a conductive via coupled to the first surface of the conductive pad; a liner on the second surface and on the lateral surfaces of the conductive pad, wherein a material of the liner includes nickel, palladium, or gold; a microelectronic component having a conductive contact; and an interconnect electrically coupling the conductive contact of the microelectronic component and the liner on the second surface of the conductive pad, wherein a material of the interconnect includes nickel or tin.