Invention Publication
- Patent Title: SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
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Application No.: US18139060Application Date: 2023-04-25
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Publication No.: US20240096988A1Publication Date: 2024-03-21
- Inventor: Michael Hell , Rudolf Elpelt
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Priority: DE 2022110998.4 2022.05.04
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L21/04 ; H01L29/08 ; H01L29/16 ; H01L29/66 ; H01L29/78

Abstract:
A semiconductor device includes a transistor. The transistor includes gate trenches formed in a semiconductor substrate, extending in a first horizontal direction and patterning the semiconductor substrate into ridges. The ridges are arranged between two adjacent gate trenches, respectively. The transistor further includes a gate electrode arranged in at least one of the gate trenches, a source region of a first conductivity type, a channel region, and a drift region of the first conductivity type. The source region, channel region and a part of the drift region are arranged in the ridges. The gate electrode is insulated from the channel region and the drift region. The channel region includes a doped portion of a second conductivity type. A doping concentration of the doped portion decreases in a second horizontal direction intersecting the first horizontal direction from a region close to the gate electrode to a central portion of the ridge.
Information query
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