Invention Publication
- Patent Title: POLYMERIC FILMS AS AN ADHESIVE PROMOTION/BUFFER LAYER AT GLASS-DIELECTRIC OR METAL-DIELECTRIC INTERFACES
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Application No.: US18061126Application Date: 2022-12-02
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Publication No.: US20240186136A1Publication Date: 2024-06-06
- Inventor: Mahdi Mohammadighaleni , Whitney M. Bryks , Shayan Kaviani , Joshua J. Stacey , Thomas S. Heaton
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L21/02
- IPC: H01L21/02 ; C23C16/02
Abstract:
In one embodiment, an integrated circuit apparatus (e.g., package substrate) includes a polymeric layer between a metal and a dielectric or between a metal and a glass. The polymeric layer may be conformally deposited using a vacuum-based vapor deposition technique, e.g., initiated chemical vapor deposition (iCVD).
Information query
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