Invention Publication
- Patent Title: POLYMER LAYERS FOR ADHESIVE PROMOTION AND STRESS MANAGEMENT IN GLASS LAYERS IN INTEGRATED CIRCUIT DEVICES
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Application No.: US18061083Application Date: 2022-12-02
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Publication No.: US20240186264A1Publication Date: 2024-06-06
- Inventor: Yi Yang , Eungnak Han , Suddhasattwa Nad , Marcel A. Wall
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L23/00
- IPC: H01L23/00 ; B32B17/10 ; C09D201/00 ; H01L21/48 ; H01L23/15 ; H01L23/498
Abstract:
In one embodiment, an apparatus includes a glass substrate, a metal, and a polymeric layer between the metal and the glass substrate. The polymeric layer includes polymer molecules with an R1 group, an R2 group, a polymer backbone between the R1 group and R2 group, and an R3 group side-attached to the polymer backbone. The polymeric layer is bonded to the glass substrate via the R1 groups and bonded to the metal via the R2 groups.
Information query
IPC分类:
