Invention Application
- Patent Title: PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, AND METHOD FOR PRODUCING LAYERED BODY
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Application No.: US18699058Application Date: 2022-10-03
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Publication No.: US20240402603A1Publication Date: 2024-12-05
- Inventor: Yusaku WATANABE , Akiko TAKEDA , Mao NARITA , Keishi ONO
- Applicant: Resonac Corporation
- Applicant Address: JP Tokyo
- Assignee: Resonac Corporation
- Current Assignee: Resonac Corporation
- Current Assignee Address: JP Tokyo
- Priority: JP2021-165266 20211007
- International Application: PCT/JP2022/036969 WO 20221003
- Main IPC: G03F7/033
- IPC: G03F7/033 ; C08F212/08 ; C08K5/3472 ; C08K5/36

Abstract:
A photosensitive resin composition containing a binder polymer, a photopolymerizable compound, a photopolymerization initiator, and a tetrazole compound, in which a content of a monomer unit of a styrene compound in the binder polymer is more than 30% by mass, and a content of the tetrazole compound is 0.01 parts by mass or more with respect to 100 parts by mass of the total of the binder polymer and the photopolymerizable compound.
Information query
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