公开(公告)号：US20240402603A1

公开(公告)日：2024-12-05

申请号：US18699058

申请日：2022-10-03

Applicant: Resonac Corporation

Inventor： Yusaku WATANABE ,  Akiko TAKEDA ,  Mao NARITA ,  Keishi ONO

IPC: G03F7/033 ,  C08F212/08 ,  C08K5/3472 ,  C08K5/36

Abstract: A photosensitive resin composition containing a binder polymer, a photopolymerizable compound, a photopolymerization initiator, and a tetrazole compound, in which a content of a monomer unit of a styrene compound in the binder polymer is more than 30% by mass, and a content of the tetrazole compound is 0.01 parts by mass or more with respect to 100 parts by mass of the total of the binder polymer and the photopolymerizable compound.