Invention Grant
- Patent Title: Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits
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Application No.: US350692Application Date: 1999-07-09
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Publication No.: US6138891APublication Date: 2000-10-31
- Inventor: Sven Evers , Craig T. Clyne
- Applicant: Sven Evers , Craig T. Clyne
- Applicant Address: ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: ID Boise
- Main IPC: B23K20/00
- IPC: B23K20/00 ; H01L21/00 ; H01L21/687 ; B23K37/04 ; B23Q3/06
Abstract:
A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide further compensation for leadframe variations.
Public/Granted literature
- US5539077A Resin composition Public/Granted day:1996-07-23
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