Invention Grant
- Patent Title: Contact temperature probe and process
- Patent Title (中): 接触式温度探头和过程
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Application No.: US10113554Application Date: 2002-03-29
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Publication No.: US06796711B2Publication Date: 2004-09-28
- Inventor: Michael Bruce Colson , Aseem Kumar Srivastava
- Applicant: Michael Bruce Colson , Aseem Kumar Srivastava
- Main IPC: G01K706
- IPC: G01K706

Abstract:
A contact measurement probe for measuring a temperature of a substrate in a process environment includes a probe head having a contact surface made of a ceramic material or a polymeric material for contacting the substrate. The contact measurement probe eliminates electrical biasing effects in process environments that include an ion source, thereby providing greater accuracy and reproducibility in temperature measurement.
Public/Granted literature
- US20030185280A1 Contact temperature probe and process Public/Granted day:2003-10-02
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