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US06989559B2 Discrete circuit component having fabrication stage clogged through-holes and process of making the same 有权
具有制造阶段堵塞的通孔的分立电路部件及其制造方法

Discrete circuit component having fabrication stage clogged through-holes and process of making the same
Abstract:
A discrete circuit component is made from a substrate with the first and second surfaces thereof each having a corresponding matrix of electrically conductive segments. A plated through-hole connects each of the conductive segments of each the first and second conductive segments electrically. The through-hole is first clogged and then subsequently cleared of clogging in the fabrication stages.
Abstract(Chinese):

离散电路部件由衬底制成，其第一和第二表面各自具有相应的导电段的矩阵。 电镀通孔将每个第一和第二导电段的导电段电连接。 首先堵塞通孔，然后在制造阶段中清除堵塞。

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