Invention Grant
US06992255B2 Via and via landing structures for smoothing transitions in multi-layer substrates
有权
通过和通过着陆结构，用于平滑多层衬底中的过渡
- Patent Title: Via and via landing structures for smoothing transitions in multi-layer substrates
- Patent Title (中): 通过和通过着陆结构，用于平滑多层衬底中的过渡
-
Application No.: US10620733Application Date: 2003-07-16
-
Publication No.: US06992255B2Publication Date: 2006-01-31
- Inventor: Modest Oprysko , Lei Shan , Jeannine M. Trewhella
- Applicant: Modest Oprysko , Lei Shan , Jeannine M. Trewhella
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Keusey, Tutunjian & Bitetto, P.C.
- Agent Anne V. Dougherty, Esq.
- Main IPC: H01R12/04
- IPC: H01R12/04 ; H05K1/11
Abstract:
An integrated circuit arrangement or package includes a set of contact pads arranged in a pattern and a multi-layer conductive structure, which electrically connects the set of contact pads to at least one signal line. The conductive structure provides impedance matching between the pads and the at least one signal line.
Public/Granted literature
- US20050011674A1 Via and via landing structures for smoothing transitions in multi-layer substrates Public/Granted day:2005-01-20
Information query
