公开(公告)号：US06992255B2

公开(公告)日：2006-01-31

申请号：US10620733

申请日：2003-07-16

Applicant: Modest Oprysko ,  Lei Shan ,  Jeannine M. Trewhella

Inventor： Modest Oprysko ,  Lei Shan ,  Jeannine M. Trewhella

IPC: H01R12/04 ,  H05K1/11

CPC classification number: H05K1/113 ,  H01L23/66 ,  H01L2223/6616 ,  H01L2223/6627 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/15173 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/1903 ,  H01L2924/3011 ,  H05K1/0237 ,  H05K2201/09627 ,  H05K2201/09727 ,  H05K2201/0979

Abstract: An integrated circuit arrangement or package includes a set of contact pads arranged in a pattern and a multi-layer conductive structure, which electrically connects the set of contact pads to at least one signal line. The conductive structure provides impedance matching between the pads and the at least one signal line.

Abstract translation: 集成电路布置或封装包括以图案布置的一组接触焊盘和多层导电结构，其将该组接触焊盘电连接到至少一个信号线。 导电结构提供焊盘和至少一个信号线之间的阻抗匹配。

公开(公告)号：US20050011674A1

公开(公告)日：2005-01-20

申请号：US10620733

申请日：2003-07-16

Applicant: Modest Oprysko ,  Lei Shan ,  Jeannine Trewhella

Inventor： Modest Oprysko ,  Lei Shan ,  Jeannine Trewhella

IPC: H01L23/66 ,  H05K1/02 ,  H05K1/11 ,  H05K7/06

CPC classification number: H05K1/113 ,  H01L23/66 ,  H01L2223/6616 ,  H01L2223/6627 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/15173 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/1903 ,  H01L2924/3011 ,  H05K1/0237 ,  H05K2201/09627 ,  H05K2201/09727 ,  H05K2201/0979

Abstract: An integrated circuit arrangement or package includes a set of contact pads arranged in a pattern and a multi-layer conductive structure, which electrically connects the set of contact pads to at least one signal line. The conductive structure provides impedance matching between the pads and the at least one signal line.

Abstract translation: 集成电路布置或封装包括以图案布置的一组接触焊盘和多层导电结构，其将该组接触焊盘电连接到至少一个信号线。 导电结构提供焊盘和至少一个信号线之间的阻抗匹配。