Invention Grant
- Patent Title: Lead frame structure with aperture or groove for flip chip in a leaded molded package
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Application No.: US11051061Application Date: 2005-02-04
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Publication No.: US07081666B2Publication Date: 2006-07-25
- Inventor: Rajeev Joshi , Chung-Lin Wu
- Applicant: Rajeev Joshi , Chung-Lin Wu
- Applicant Address: US ME South Portland
- Assignee: Fairchild Semiconductor Corporation
- Current Assignee: Fairchild Semiconductor Corporation
- Current Assignee Address: US ME South Portland
- Agency: Townsend and Townsend and Crew LLP
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/28
Abstract:
A semiconductor die package is disclosed. In one embodiment, the die package includes a semiconductor die including a first surface and a second surface, and a leadframe structure having a die attach region and a plurality of leads extending away from the die attach region. The die attach region includes one or more apertures. A molding material is around at least portions of the die attach region of the leadframe structure and the semiconductor die. The molding material is also within the one or more apertures.
Public/Granted literature
- US20050133893A1 Lead frame structure with aperture or groove for flip chip in a leaded molded package Public/Granted day:2005-06-23
Information query
IPC分类:
