Invention Grant
- Patent Title: Electronic part, and electronic part mounting element and an process for manufacturing such the articles
- Patent Title (中): 电子部件和电子部件安装元件及其制造方法
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Application No.: US11009045Application Date: 2004-12-13
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Publication No.: US07151306B2Publication Date: 2006-12-19
- Inventor: Takashi Kitae , Tsutomu Mitani , Yukihiro Ishimaru , Hiroaki Takezawa
- Applicant: Takashi Kitae , Tsutomu Mitani , Yukihiro Ishimaru , Hiroaki Takezawa
- Applicant Address: JP Osaka
- Assignee: Matsushita Electric Industrial Co., Ltd.
- Current Assignee: Matsushita Electric Industrial Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JPP11-369832 19991227; JPP2000-62983 20000308
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/48 ; H01L21/50
Abstract:
A surface of an external electrode 3 of an electronic part 4 is formed with a coating containing resin ingredient. Thereby, adhesion strength and reliability may be significantly improved in mounting an electronic part onto a circuit board 1 through the medium of a conductive adhesive. Further, it will be able to mount an electronic part to an element to be mounted by utilizing a conductive adhesive forming an external electrode 3 as a connecting element.Further, surface roughness (Ra) of an external electrode 3 of an electronic part is set to 0.1 μm or more and to 10.0 μm or less and preferably to 1.0 μm or more and to 5.0 μm or less. Thereby, adhesion strength with a conductive adhesive may be significantly enhanced in comparison with a conventional electronic part presented.
Public/Granted literature
- US20050098338A1 Electronic part, and electronic part mounting element and an process for manufacturing such the articles Public/Granted day:2005-05-12
Information query
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