公开(公告)号：US09426899B2

公开(公告)日：2016-08-23

申请号：US12439602

申请日：2008-04-24

Applicant: Takashi Kitae ,  Seiichi Nakatani ,  Seiji Karashima

Inventor： Takashi Kitae ,  Seiichi Nakatani ,  Seiji Karashima

IPC: B23P19/00 ,  H05K13/04 ,  H05K3/34 ,  H01L21/683 ,  H01L23/00 ,  H01L29/06 ,  H05K3/32

CPC classification number: H05K3/3436 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/83 ,  H01L29/0657 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11524 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/293 ,  H01L2224/73204 ,  H01L2224/8101 ,  H01L2224/81201 ,  H01L2224/81801 ,  H01L2224/83888 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10157 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H05K3/323 ,  H05K3/3484 ,  H05K2201/09036 ,  H05K2201/10977 ,  H05K2203/083 ,  H05K2203/087 ,  Y02P70/613 ,  Y10T29/49137 ,  Y10T29/49144 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: An electronic component assembly including a first electronic component including a plurality of first electrodes provided on a first major surface of the first electronic component; and a second electronic component including a plurality of second electrodes provided on a first major surface of the second electronic component. A resin including solder powder is provided between the first electronic component and the second electronic component. Also, solder connections are provided to electrically interconnect the first and second electrodes. Elongated grooves are provided in surfaces of the electronic components. The grooves are provided for generation of bubbles during the process for producing the electronic component assembly to promote movement of the solder powder.

Abstract translation: 一种电子部件组件，包括：第一电子部件，包括设置在第一电子部件的第一主表面上的多个第一电极; 以及包括设置在所述第二电子部件的第一主表面上的多个第二电极的第二电子部件。 包括焊料粉末的树脂设置在第一电子部件和第二电子部件之间。 此外，提供焊接连接以电互连第一和第二电极。 在电子部件的表面设有细长的槽。 在制造电子部件组件的过程中提供凹槽以产生气泡，以促进焊料粉末的移动。

公开(公告)号：US08193526B2

公开(公告)日：2012-06-05

申请号：US12672135

申请日：2008-08-06

Applicant: Seiichi Nakatani ,  Yoshihisa Yamashita ,  Takashi Kitae ,  Susumu Sawada

Inventor： Seiichi Nakatani ,  Yoshihisa Yamashita ,  Takashi Kitae ,  Susumu Sawada

IPC: H01L51/00

CPC classification number: H01L51/057 ,  H01L27/3274 ,  H01L27/3276 ,  H01L51/0096 ,  Y02E10/549 ,  Y02P70/521

Abstract: A semiconductor device having a semiconductor elements formed with higher density is provided. Furthermore an image display device using the semiconductor device is also provided.A semiconductor device comprising a resin film that has a through hole that penetrates from one surface to the other surface thereof, a source electrode disposed along the inner wall of the through hole, a drain electrode disposed along the inner wall of the through hole, a gate electrode disposed on the other surface of the resin film opposing the through hole, an insulating layer disposed on the gate electrode at the bottom of the through hole and an organic semiconductor disposed in the through hole so as to contact the source electrode and the drain electrode, wherein the organic semiconductor makes contact with at least a part of the insulating layer at the bottom of the through hole so that a channel is formed in the organic semiconductor in the vicinity of the insulating layer that is in contact therewith.

Abstract translation: 提供了具有以更高密度形成的半导体元件的半导体器件。 此外，还提供了使用该半导体器件的图像显示装置。 一种半导体器件，包括具有从一个表面到另一个表面穿透的通孔的树脂膜，沿着通孔的内壁设置的源电极，沿该通孔的内壁设置的漏电极， 设置在与通孔相对的树脂膜的另一个表面上的栅电极，设置在通孔底部的栅电极上的绝缘层和布置在通孔中的有机半导体，以便与源电极和漏极 电极，其中有机半导体与通孔底部的绝缘层的至少一部分接触，使得在与其接触的绝缘层附近的有机半导体中形成沟道。

公开(公告)号：US20110201195A1

公开(公告)日：2011-08-18

申请号：US13091801

申请日：2011-04-21

Applicant: Takashi KITAE ,  Seiichi NAKATANI ,  Seiji KARASHIMA ,  Yoshihisa YAMASHITA ,  Takashi ICHIRYU

Inventor： Takashi KITAE ,  Seiichi NAKATANI ,  Seiji KARASHIMA ,  Yoshihisa YAMASHITA ,  Takashi ICHIRYU

IPC: H01L21/283

CPC classification number: H01L24/16 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/13 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11001 ,  H01L2224/11003 ,  H01L2224/1141 ,  H01L2224/11502 ,  H01L2224/11522 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/13105 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/165 ,  H01L2224/2741 ,  H01L2224/27436 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/29299 ,  H01L2224/29305 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/29313 ,  H01L2224/29316 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2224/832 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/8388 ,  H01L2224/83885 ,  H01L2224/83886 ,  H01L2224/83887 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1579 ,  H01L2924/381 ,  H01L2924/3841 ,  H05K3/323 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/10977 ,  H05K2203/0264 ,  H05K2203/087 ,  H05K2203/1178 ,  Y02P70/613 ,  H01L2924/01031 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01083 ,  H01L2924/00011 ,  H01L2924/00015 ,  H01L2924/066 ,  H01L2924/06 ,  H01L2924/0675 ,  H01L2924/0695 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: The invention involves mounting a solder resin composition (6) including a solder powder (5a) and a resin (4) on the first electronic component (2); arranging such that the connecting terminals (3) of the first electronic component (2) and the electrode terminals (7) of the second electronic component (8) are facing each other; ejecting a gas (9a) from a gas generation source (1) included in the first electronic component (2) by heating the first electronic component (2) and the solder resin composition; and inducing the flow of the solder powder (5a) in the solder resin composition (6) by inducing convection of the gas (9a) in the solder resin composition (6), and electrically connecting the connecting terminals (3) and the electrode terminals (7) by self-assembly on the connecting terminals (3) and the electrode terminals (7). Through this are provided a flip chip packaging method that enables connecting, with high connection reliability, electrode terminals of a semiconductor chip wired with narrow pitch and connecting terminals of a circuit board, and a bump formation method for packaging on a circuit board.

Abstract translation: 本发明涉及将包含焊料粉末（5a）和树脂（4）的焊料树脂组合物（6）安装在第一电子部件（2）上; 排列成使得第一电子部件（2）的连接端子（3）和第二电子部件（8）的电极端子（7）彼此面对; 通过加热第一电子部件（2）和焊料树脂组合物，从包括在第一电子部件（2）中的气体发生源（1）喷出气体（9a） 并且通过引起焊料树脂组合物（6）中的气体（9a）的对流而引起焊料粉末（5a）在焊料树脂组合物（6）中的流动，并将连接端子（3）和电极端子 （7）通过在连接端子（3）和电极端子（7）上的自组装。 通过这种方式提供了一种倒装芯片封装方法，其以高连接可靠性连接具有窄间距的半导体芯片的电极端子和电路板的连接端子，以及用于封装在电路板上的凸块形成方法。

公开(公告)号：US07640654B2

公开(公告)日：2010-01-05

申请号：US11701502

申请日：2007-02-02

Applicant: Seiichi Nakatani ,  Seiji Karashima ,  Takashi Kitae

Inventor： Seiichi Nakatani ,  Seiji Karashima ,  Takashi Kitae

IPC: H05K3/30

CPC classification number: H05K3/303 ,  H01L2224/95146 ,  H05K13/0404 ,  H05K13/0469 ,  H05K2201/10636 ,  H05K2203/0776 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/5313 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53265 ,  Y10T29/53539

Abstract: A pickup device comprising a pickup surface to which an electronic component retaining liquid is to be applied and capable of adjusting a wet area of the electronic component retaining liquid on the pickup surface is prepared, and the electronic component retaining liquid is applied to the pickup surface in a first step. The electronic component is retained on the pickup surface via the electronic component retaining liquid in a state where the wet area is extended in a second step.

Abstract translation: 准备拾取装置，该拾取装置包括拾取表面，待拾取表面上的电子部件保留液体，并且能够调整电子部件保持液在拾取表面上的湿润区域，并将电子部件保持液施加到拾取表面 在第一步。 在第二步骤中，在湿区域延伸的状态下，电子部件经由电子部件保持液保持在拾取面上。

公开(公告)号：US07531387B1

公开(公告)日：2009-05-12

申请号：US11887332

申请日：2006-03-16

Applicant: Seiji Karashima ,  Takashi Kitae ,  Seiichi Nakatani

Inventor： Seiji Karashima ,  Takashi Kitae ,  Seiichi Nakatani

IPC: H01L21/00 ,  H01L21/44 ,  H01R12/02 ,  H05K1/11 ,  B23K35/14

CPC classification number: H05K3/3484 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/73 ,  H01L24/742 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11001 ,  H01L2224/11005 ,  H01L2224/1141 ,  H01L2224/11502 ,  H01L2224/11522 ,  H01L2224/11849 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/1601 ,  H01L2224/16058 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/165 ,  H01L2224/16505 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/293 ,  H01L2224/29311 ,  H01L2224/29313 ,  H01L2224/29316 ,  H01L2224/29347 ,  H01L2224/294 ,  H01L2224/29411 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/742 ,  H01L2224/75 ,  H01L2224/83097 ,  H01L2224/83192 ,  H01L2224/83204 ,  H01L2224/83211 ,  H01L2224/83855 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/8388 ,  H01L2224/83886 ,  H01L2224/83887 ,  H01L2924/00014 ,  H01L2924/01002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/301 ,  H01L2924/30105 ,  H01L2924/381 ,  H05K3/323 ,  H05K2201/10977 ,  H05K2203/0425 ,  H05K2203/087 ,  H05K2203/1178 ,  Y10T156/1744 ,  H01L2924/00011 ,  H01L2924/0103 ,  H01L2924/01051 ,  H01L2924/01083 ,  H01L2924/00015 ,  H01L2924/066 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A flip chip mounting method which is applicable to the flip chip mounting of a next-generation LSI and high in productivity and reliability as well as a bump forming method are provided. After a resin 14 containing a solder powder 16 and a gas bubble generating agent is supplied to a space between a circuit board 21 having a plurality of connecting terminals 11 and a semiconductor chip 20 having a plurality of electrode terminals 12, the resin 14 is heated to generate gas bubbles 30 from the gas bubble generating agent contained in the resin 14. The resin 14 is pushed toward the outside of the generated gas bubbles 30 by the growth thereof and self-assembled between the connecting terminals 11 and the electrode terminals 12. By further heating the resin 14 and melting the solder powder 16 contained in the resin 14 self-assembled between the terminals, connectors 22 are formed between the terminals to complete a flip chip mounting body.

公开(公告)号：US20090008800A1

公开(公告)日：2009-01-08

申请号：US11909856

申请日：2006-03-14

Applicant: Seiichi Nakatani ,  Takashi Kitae ,  Yoshihisa Yamashita ,  Takashi Ichiryu ,  Seiji Karashima

Inventor： Seiichi Nakatani ,  Takashi Kitae ,  Yoshihisa Yamashita ,  Takashi Ichiryu ,  Seiji Karashima

IPC: H01L23/48 ,  H01L21/58

CPC classification number: H01L24/81 ,  H01L21/563 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75251 ,  H01L2224/83007 ,  H01L2224/83097 ,  H01L2224/83192 ,  H01L2224/83815 ,  H01L2224/83874 ,  H01L2224/8388 ,  H01L2224/83888 ,  H01L2224/9201 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/0695 ,  H01L2224/05599

Abstract: The flip chip mounted body of the present invention includes: a circuit board (213) having a plurality of connection terminals (211); a semiconductor chip (206) having a plurality of electrode terminals (207) that are disposed opposing the connection terminals (211); and a porous sheet (205) having a box shape that is provided on an opposite side of a formation surface of the electrode terminal (207) of the semiconductor chip (206), is folded on an outer periphery of the semiconductor chip (206) on the formation surface side of the electrode terminal (207) and is in contact with the circuit board (213), wherein the connection terminal (211) of the circuit board (213) and the electrode terminal (207) of the semiconductor chip (206) are connected electrically via a solder layer (215), and the circuit board (213) and the semiconductor chip (206) are fixed by a resin (217). Thereby, the flip chip mounted body with excellent productivity and reliability that can mount the semiconductor chip on the circuit board, and a method and an apparatus for mounting the flip chip mounted body are provided.

Abstract translation: 本发明的倒装芯片安装体包括：具有多个连接端子（211​​）的电路板（213）; 具有与所述连接端子相对设置的多个电极端子（207）的半导体芯片（206）。 在所述半导体芯片（206）的外周折叠具有设置在所述半导体芯片（206）的所述电极端子（207）的形成面的相反侧的盒状的多孔片（205） 在电极端子（207）的形成面侧与电路基板（213）接触，电路基板（213）的连接端子（211​​）和半导体芯片的电极端子（207） 206）通过焊料层（215）电连接，并且电路板（213）和半导体芯片（206）由树脂（217）固定。 因此，提供了将半导体芯片安装在电路板上的优异的生产率和可靠性的倒装芯片安装体以及安装倒装芯片安装体的方法和装置。

公开(公告)号：US20080197173A1

公开(公告)日：2008-08-21

申请号：US11579505

申请日：2006-04-25

Applicant: Takashi Kitae ,  Seiichi Nakatani ,  Toshiyuki Kojima ,  Shingo Komatsu ,  Yoshihisa Yamashita

Inventor： Takashi Kitae ,  Seiichi Nakatani ,  Toshiyuki Kojima ,  Shingo Komatsu ,  Yoshihisa Yamashita

IPC: B23K31/02 ,  B23K1/20

CPC classification number: H05K3/3484 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/0558 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/11003 ,  H01L2224/1152 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81141 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/15787 ,  H01L2924/15788 ,  H05K3/323 ,  H05K3/3436 ,  H05K2201/09745 ,  H05K2201/10977 ,  H05K2203/0108 ,  H05K2203/0113 ,  H05K2203/043 ,  H05K2203/0465 ,  H05K2203/167 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/29099

Abstract: [Problem] To provide a method for forming solder bumps for realizing high density mounting and a highly reliable method for mounting a semiconductor device.[Means for Solving Problem] A flat plate 10 or 30 having a plurality of projections 12 or recesses 32 thereon is prepared; the flat plate is aligned to oppose an electronic component 14 or 34 and a resin composition 18 or 19 including a solder powder 22 or 23 is supplied to a gap between the flat plate and the electronic component; the resin composition is annealed to melt the solder powder included in the resin composition for growing the solder powder up to the level of the surface of the flat plate by allowing the melted solder powder to self-assemble on terminals 16 or 36, so as to form solder bumps 24 or 38 on the terminals; and the flat plate is removed after cooling and solidifying the solder bumps. Thus, the solder bumps 24 or 38 having pits 24a corresponding to the projections 12 or having projections 38a corresponding to the recesses 32 are formed.

Abstract translation: [问题]提供一种形成用于实现高密度安装的焊料凸块的方法和用于安装半导体器件的高可靠性方法。 [解决问题的手段]准备在其上具有多个突起12或凹部32的平板10或30; 平板对准电子部件14或34，并且包括焊料粉末22或23的树脂组合物18或19被供应到平板和电子部件之间的间隙; 对树脂组合物进行退火，通过使熔融的焊料粉末在端子16或36上自组装，将包含在用于生长焊料粉末的树脂组合物中的焊料粉末熔化至平板表面的高度，从而 在端子上形成焊料凸块24或38; 并且在冷却并固化焊料凸块之后去除平板。 因此，形成具有对应于突起12的凹坑24a或具有对应于凹部32的突起38a的焊料凸块24或38。

公开(公告)号：US20080017995A1

公开(公告)日：2008-01-24

申请号：US11662286

申请日：2005-09-07

Applicant: Seiji Karashima ,  Yoshihisa Yamashita ,  Satoru Tomekawa ,  Takashi Kitae ,  Seiichi Nakatani

Inventor： Seiji Karashima ,  Yoshihisa Yamashita ,  Satoru Tomekawa ,  Takashi Kitae ,  Seiichi Nakatani

IPC: H01L23/12 ,  H01L21/603

CPC classification number: H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/13 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/1152 ,  H01L2224/131 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/1601 ,  H01L2224/16145 ,  H01L2224/16238 ,  H01L2224/29011 ,  H01L2224/29035 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/293 ,  H01L2224/32052 ,  H01L2224/32145 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/818 ,  H01L2224/83102 ,  H01L2224/83191 ,  H01L2224/83203 ,  H01L2224/83886 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/323 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/10977 ,  H05K2203/0278 ,  H05K2203/0425 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/254 ,  Y10T428/31681 ,  H01L2924/00 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2924/01083 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: There is provided a flip chip mounting process which is high in productivity and reliability, and thus can be applicable to the flip chip mounting of the next-generation LSI. This flip chip mounting process comprises the steps of supplying a resin (13) containing solder powder and a convection additive (12) onto a wiring substrate (10) having a plurality of electrode terminals (11), then bringing a semiconductor chip (20) having a plurality of connecting terminals (11) into contact with a surface of the supplied resin (13), and then heating the wiring substrate (10) to a temperature that enables the solder powder to melt. This heating step is carried out at a temperature higher than the boiling point of the convection additive (12) to allow the boiling convection additive (12) to move within the resin (12). During this heating step, the melted solder powder is allowed to self-assemble into the region between each electrode terminal (11) of the wiring substrate (10) and each connecting terminal (21) of the semiconductor chip to form an electrical connection between each electrode terminal (11) and each connecting terminal (21). Finally, the resin is cured so as to secure the semiconductor chip (20) to the wiring substrate (10).

Abstract translation: 提供了一种倒装芯片安装工艺，其生产率和可靠性高，因此可以适用于下一代LSI的倒装芯片安装。 这种倒装芯片安装工艺包括以下步骤：将含有焊料粉末的树脂（13）和对流添加剂（12）提供到具有多个电极端子（11）的布线基板（10）上，然后将半导体芯片（20） 具有与供给的树脂（13）的表面接触的多个连接端子（11），然后将布线基板（10）加热到使焊料粉末熔化的温度。 该加热步骤在高于对流添加剂（12）的沸点的温度下进行，以允许沸腾对流添加剂（12）在树脂（12）内移动。 在该加热步骤中，使熔融的焊料粉末自组装到布线基板（10）的每个电极端子（11）与半导体芯片的每个连接端子（21）之间的区域中，以形成每个 电极端子（11）和每个连接端子（21）。 最后，树脂被固化，以将半导体芯片（20）固定到布线基板（10）上。

公开(公告)号：US20070257362A1

公开(公告)日：2007-11-08

申请号：US11661821

申请日：2005-08-30

Applicant: Seiji Karashima ,  Yoshihisa Yamashita ,  Satoru Tomekawa ,  Takashi Kitae ,  Seiichi Nakatani

Inventor： Seiji Karashima ,  Yoshihisa Yamashita ,  Satoru Tomekawa ,  Takashi Kitae ,  Seiichi Nakatani

IPC: H01L21/44 ,  B23K35/34

CPC classification number: H05K3/3484 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/1152 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2224/83874 ,  H01L2224/8388 ,  H01L2224/83886 ,  H01L2224/92125 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/1579 ,  H05K3/323 ,  H05K2201/10977 ,  H05K2203/0278 ,  H05K2203/043 ,  H05K2203/083 ,  H05K2203/087 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2924/00015 ,  H01L2924/00014

Abstract: There is provided a process for forming bumps wherein a plurality of fine bumps are uniformly formed with high productivity. In this process, a resin (13) comprising solder powder and a convection additive (12) is supplied onto a substrate (10) having a plurality of electrodes (11) thereon. And subsequently the substrate (10) is heated to a temperature that enables the solder powder to melt while keeping a flat plate (14) in contact with a surface of the supplied resin (13). During this heating step, the molten solder powder is allowed to self-assemble onto the electrodes (11) so that a plurality of solder balls resulting from the grown molten solder powder are concurrently formed on the electrodes (11) in self-alignment manner. Finally, by moving the flat plate (14) away from the surface of the supplied resin (13), followed by removing such resin (13), there is provided the substrate (10) wherein the bumps (16) are formed on the plurality of the electrodes.

Abstract translation: 提供了一种用于形成凸块的方法，其中以高生产率均匀地形成多个细小凸块。 在该方法中，将包含焊料粉末和对流添加剂（12）的树脂（13）供给到其上具有多个电极（11）的基板（10）上。 然后将衬底（10）加热到使焊料粉末熔化同时保持平板（14）与所供应的树脂（13）的表面接触的温度。 在该加热步骤中，允许熔融焊料粉末自组装到电极（11）上，从而以自对准的方式在电极（11）上同时形成由生长的熔融焊料粉末产生的多个焊料球。 最后，通过将平板（14）移动远离所提供的树脂（13）的表面，随后除去这种树脂（13），设置有多个基板（10），其中凸块（16）形成在多个 的电极。

公开(公告)号：US06916433B2

公开(公告)日：2005-07-12

申请号：US10030235

申请日：2001-02-27

Applicant: Tsutomi Mitani ,  Hiroaki Takezawa ,  Yukihiro Ishimaru ,  Takashi Kitae ,  Yasuhiro Suzuki

Inventor： Tsutomi Mitani ,  Hiroaki Takezawa ,  Yukihiro Ishimaru ,  Takashi Kitae ,  Yasuhiro Suzuki

IPC: C09J9/02 ,  H05K3/32 ,  H01B1/22 ,  H01L23/04

CPC classification number: H05K3/321 ,  C09J9/02 ,  H05K2201/0245 ,  H05K2201/0272 ,  H05K2201/10636 ,  H05K2203/0278 ,  H05K2203/0307 ,  Y02P70/611 ,  Y10T428/2982

Abstract: A conductive adhesive comprises main components of a conductive filler and a binder resin, and a content of the conductive filler is in a range from 20 wt % to 70 wt %. It is preferable that at least a part of the conductive filler has protrusions. A dendrite metal filler is especially preferred. When this adhesive is compressed, the resin component is squeezed out, while the conductive filler component remains inside. As a result, the concentration of the conductive filler component is raised inside, and this is useful in connecting the electrodes by scratching the surfaces of the electrodes. No solder is required in forming a conductive adhesive 3 on a substrate electrode 2 of a circuit substrate 1 and also for packaging an electronic element 4. Provided also are a package of an electronic element using the conductive adhesive with improved initial and long-term reliability, and a method of packaging the same.

Abstract translation: 导电粘合剂包括导电填料和粘合剂树脂的主要组分，并且导电填料的含量在20重量％至70重量％的范围内。 导电填料的至少一部分优选具有突起。 特别优选枝晶金属填料。 当该粘合剂被压缩时，树脂组分被挤出，而导电填料组分保留在内部。 结果，导电填料组分的浓度升高到内部，并且这通过划伤电极的表面来连接电极是有用的。 在电路基板1的基板电极2上形成导电性粘接剂3也需要焊料，也可以包装电子元件4。 还提供了使用导电粘合剂的电子元件的包装，其具有改善的初始和长期可靠性，以及包装该电子元件的方法。