Invention Grant
- Patent Title: Array capacitor with IC contacts and applications
- Patent Title (中): 阵列电容与IC触点和应用
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Application No.: US10952968Application Date: 2004-09-28
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Publication No.: US07173804B2Publication Date: 2007-02-06
- Inventor: Kaladhar Radhakrishnan , Larry E. Mosley , Dustin P. Wood , Nicholas L. Holmberg
- Applicant: Kaladhar Radhakrishnan , Larry E. Mosley , Dustin P. Wood , Nicholas L. Holmberg
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01G4/228
- IPC: H01G4/228
Abstract:
An apparatus having a first set of contacts on a first side of the apparatus adapted to interface with a corresponding plurality of contacts on an integrated circuit package. The apparatus further includes a second set of contacts on a second side of the apparatus adapted to interface with a corresponding plurality of grid array leads, and a plurality of capacitive storage structures coupled to the first and second sets of contacts.
Public/Granted literature
- US20060067030A1 Array capacitor with IC contacts and applications Public/Granted day:2006-03-30
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