Invention Grant
- Patent Title: Integrated circuit package with improved power signal connection
- Patent Title (中): 集成电路封装，具有改进的电源信号连接
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Application No.: US10831795Application Date: 2004-04-26
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Publication No.: US07183644B2Publication Date: 2007-02-27
- Inventor: Dustin P. Wood , Kaladhar Radhakrishnan
- Applicant: Dustin P. Wood , Kaladhar Radhakrishnan
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Buckley, Maschoff & Talwalkar LLC.
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L23/48 ; H01L23/52
Abstract:
An integrated circuit (IC) package includes a substrate and an IC die mounted on a first side of the substrate. The IC package also includes a plurality of capacitors mounted on a second side of the substrate. The second side is opposite to the first side. The IC package further includes a plurality of conductive contact pads formed on the second side of the substrate and interspersed among the capacitors. Other embodiments are described and claimed.
Public/Granted literature
- US20050236707A1 Integrated circuit package with improved power signal connection Public/Granted day:2005-10-27
Information query
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