Invention Grant
US07238891B2 Circuit board with at least one rigid and at least one flexible area and process for producing rigid-flexible circuit boards
有权
具有至少一个刚性和至少一个柔性区域的电路板以及用于制造刚性柔性电路板的工艺
- Patent Title: Circuit board with at least one rigid and at least one flexible area and process for producing rigid-flexible circuit boards
- Patent Title (中): 具有至少一个刚性和至少一个柔性区域的电路板以及用于制造刚性柔性电路板的工艺
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Application No.: US10528648Application Date: 2003-09-19
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Publication No.: US07238891B2Publication Date: 2007-07-03
- Inventor: Roland Muenzberg
- Applicant: Roland Muenzberg
- Applicant Address: DE Wetter/Hessen
- Assignee: Ruwel AG
- Current Assignee: Ruwel AG
- Current Assignee Address: DE Wetter/Hessen
- Agent David S. Safran
- Priority: DE10243637 20020919
- International Application: PCT/EP03/10438 WO 20030919
- International Announcement: WO2004/032583 WO 20040415
- Main IPC: H05K1/03
- IPC: H05K1/03
Abstract:
A rigid-flexible circuit board with two rigid areas and one flexible area, with a rigid individual layer which is copper-clad on one side, with an adhesive medium and with a copper foil, the adhesive medium having recesses in the flexible area. The rigid-flexible circuit board can be produced especially easily and economically in that at least in the rigid area there is no flexible individual layer, especially no polyimide film, between the adhesive medium and the copper foil.
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