公开(公告)号：US07238891B2

公开(公告)日：2007-07-03

申请号：US10528648

申请日：2003-09-19

Applicant: Roland Muenzberg

Inventor： Roland Muenzberg

IPC: H05K1/03

CPC classification number: H05K3/4691 ,  H05K3/28 ,  H05K3/386 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2203/063

Abstract: A rigid-flexible circuit board with two rigid areas and one flexible area, with a rigid individual layer which is copper-clad on one side, with an adhesive medium and with a copper foil, the adhesive medium having recesses in the flexible area. The rigid-flexible circuit board can be produced especially easily and economically in that at least in the rigid area there is no flexible individual layer, especially no polyimide film, between the adhesive medium and the copper foil.

Abstract translation: 具有两个刚性区域和一个柔性区域的刚性柔性电路板，具有在一侧铜包覆的刚性单层，具有粘合剂介质和铜箔，所述粘合剂介质在柔性区域中具有凹部。 刚性柔性电路板可以特别容易且经济地制造，因为至少在刚性区域中，在粘合剂介质和铜箔之间没有柔性单独层，特别是没有聚酰亚胺膜。

公开(公告)号：US20060007641A1

公开(公告)日：2006-01-12

申请号：US10528648

申请日：2003-09-19

Applicant: Roland Muenzberg

Inventor： Roland Muenzberg

IPC: H02B1/00

CPC classification number: H05K3/4691 ,  H05K3/28 ,  H05K3/386 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2203/063

Abstract: A rigid-flexible circuit board with two rigid areas (2) and one flexible area (3), with a rigid individual layer (4) which is copper-clad on one side, with an adhesive medium (7) and with a copper foil (8), the adhesive medium (7) having recesses in the flexible area (3). The rigid-flexible circuit board (1) can be produced especially easily and economically in that at least in the rigid area (2) there is no flexible individual layer (9), especially no polyimide film, between the adhesive medium (7) and the copper foil (8).

Abstract translation: 具有两个刚性区域（2）和一个柔性区域（3）的刚性柔性电路板，具有在一侧铜包覆的刚性单层（4），具有粘合介质（7）和铜箔 （8），所述粘合介质（7）在所述柔性区域（3）中具有凹部。 刚性柔性电路板（1）可以特别容易且经济地制造，因为至少在刚性区域（2）中，粘合剂介质（7）和粘合剂介质（7）之间没有柔性单独层（9），特别是没有聚酰亚胺膜 铜箔（8）。