Invention Grant
- Patent Title: Heat dissipation mechanism for electronic apparatus
- Patent Title (中): 电子设备散热机构
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Application No.: US11056533Application Date: 2005-02-11
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Publication No.: US07307844B2Publication Date: 2007-12-11
- Inventor: Chung-Ju Wu
- Applicant: Chung-Ju Wu
- Applicant Address: TW
- Assignee: Silicon Integrated Systems Corp.
- Current Assignee: Silicon Integrated Systems Corp.
- Current Assignee Address: TW
- Agency: Squire Sanders & Dempsey, LLP
- Priority: TW93136836A 20041130
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
This disclosure presents a heat dissipation mechanism, which conducts generated heat of a thermal device to the housing of an electronic apparatus by a metal piece fastened between the thermal device and electronic apparatus, and then dissipates heat into the air through multiple holes opened over an apparatus shell. Besides, the presented mechanism is also suitable to mini-size, portable electronic apparatus to solve the thermal dissipation technique thereof.
Public/Granted literature
- US20050111195A1 Heat dissipation mechanism for electronic apparatus Public/Granted day:2005-05-26
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