Invention Grant
US07332806B2 Thin, thermally enhanced molded package with leadframe having protruding region
有权
薄的，热增强的模制包装，具有突出区域的引线框架
- Patent Title: Thin, thermally enhanced molded package with leadframe having protruding region
- Patent Title (中): 薄的，热增强的模制包装，具有突出区域的引线框架
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Application No.: US11048314Application Date: 2005-01-31
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Publication No.: US07332806B2Publication Date: 2008-02-19
- Inventor: Rajeev Joshi , Chung-Lin Wu
- Applicant: Rajeev Joshi , Chung-Lin Wu
- Applicant Address: US ME South Portland
- Assignee: Fairchild Semiconductor Corporation
- Current Assignee: Fairchild Semiconductor Corporation
- Current Assignee Address: US ME South Portland
- Agency: Townsend and Townsend and Crew LLP
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/495 ; H01L23/34 ; H01L29/76
Abstract:
A semiconductor die package. It includes (a) a semiconductor die including a first surface and a second surface, (b) a source lead structure including protruding region having a major surface, the source lead structure being coupled to the first surface, (c) a gate lead structure being coupled to the first surface, and (d) a molding material around the source lead structure and the semiconductor die. The molding material exposes the second surface of the semiconductor die and the major surface of the source lead structure.
Public/Granted literature
- US20050127483A1 Thin, thermally enhanced flip chip in a leaded molded package Public/Granted day:2005-06-16
Information query
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