Invention Grant
- Patent Title: Integrated circuit package with improved power signal connection
- Patent Title (中): 集成电路封装，具有改进的电源信号连接
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Application No.: US11652425Application Date: 2007-01-11
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Publication No.: US07348214B2Publication Date: 2008-03-25
- Inventor: Dustin P. Wood , Kaladhar Radhakrishnan
- Applicant: Dustin P. Wood , Kaladhar Radhakrishnan
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Buckley, Maschoff & Talwalkar LLC
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/48 ; H01L21/50
Abstract:
An integrated circuit (IC) package includes a substrate and an IC die mounted on a first side of the substrate. The IC package also includes a plurality of capacitors mounted on a second side of the substrate. The second side is opposite to the first side. The IC package further includes a plurality of conductive contact pads formed on the second side of the substrate and interspersed among the capacitors. Other embodiments are described and claimed.
Public/Granted literature
- US20070114675A1 Integrated circuit package with improved power signal connection Public/Granted day:2007-05-24
Information query
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