Invention Grant
- Patent Title: Semiconductor device electronic component, circuit board, and electronic device
- Patent Title (中): 半导体器件电子元件，电路板和电子器件
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Application No.: US11500264Application Date: 2006-08-07
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Publication No.: US07432585B2Publication Date: 2008-10-07
- Inventor: Nobuaki Hashimoto
- Applicant: Nobuaki Hashimoto
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2005-231573 20050810
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H01L21/44
Abstract:
A semiconductor device includes: a semiconductor substrate having an active face; a first electrode provided on or above the active face; an external connection terminal provided on or above the active face and electrically connected to the first electrode; and a connection terminal provided on or above the active face of the semiconductor substrate.
Public/Granted literature
Information query
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