公开(公告)号：US08465138B2

公开(公告)日：2013-06-18

申请号：US13537815

申请日：2012-06-29

Applicant: Nobuaki Hashimoto

Inventor： Nobuaki Hashimoto

IPC: B41J2/175

CPC classification number: B41J2/17546 ,  B41J2/17566 ,  B41J2002/17579

Abstract: A semiconductor device includes: a semiconductor substrate including an active element formation face on which an active element is formed; detection electrodes detecting a remaining amount of ink by being wet in the ink; an antenna transmitting and receiving information; a storage circuit storing information relating to the ink; and a control circuit controlling the detection electrodes, the antenna, and the storage circuit.

Abstract translation: 半导体器件包括：半导体衬底，其包括形成有源元件的有源元件形成面; 检测电极通过在墨水中湿润来检测墨水的剩余量; 发送和接收信息的天线; 存储与油墨有关的信息的存储电路; 以及控制检测电极，天线和存储电路的控制电路。

公开(公告)号：US08138612B2

公开(公告)日：2012-03-20

申请号：US12719033

申请日：2010-03-08

Applicant: Nobuaki Hashimoto

Inventor： Nobuaki Hashimoto

IPC: H01L23/48

CPC classification number: H01L24/10 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05184 ,  H01L2224/05548 ,  H01L2224/05644 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A semiconductor device including: a semiconductor substrate including an electrode; a resin protrusion formed on the semiconductor substrate and including a plurality of first portions and a second portion disposed between two of the first portions adjacent to each other; and an interconnect electrically connected to the electrode and extending over one of the first portions of the resin protrusion. A lower portion of a side surface of the second portion includes a portion which extends in a direction intersecting a direction in which the resin protrusion extends.

Abstract translation: 一种半导体器件，包括：包括电极的半导体衬底; 树脂突起，其形成在所述半导体基板上并且包括多个第一部分和设置在彼此相邻的所述第一部分中的两个之间的第二部分; 以及电连接到电极并且在树脂突起的一个第一部分上延伸的互连。 第二部分的侧表面的下部包括沿与树脂突起延伸的方向相交的方向延伸的部分。

公开(公告)号：US08115284B2

公开(公告)日：2012-02-14

申请号：US12986408

申请日：2011-01-07

Applicant: Nobuaki Hashimoto

Inventor： Nobuaki Hashimoto

IPC: H01L23/495

CPC classification number: H01L24/16 ,  H01L23/3114 ,  H01L23/3171 ,  H01L23/36 ,  H01L23/5329 ,  H01L24/03 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0231 ,  H01L2224/02377 ,  H01L2224/0401 ,  H01L2224/05569 ,  H01L2224/1191 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2224/14131 ,  H01L2224/16 ,  H01L2224/73104 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/351 ,  H01L2924/00

Abstract: A semiconductor device with its package size close to its chip size has a stress absorbing layer, allows a patterned flexible substrate to be omitted, and allows a plurality of components to be fabricated simultaneously. There is: a step of forming electrodes on a wafer; a step of providing a resin later as a stress relieving layer on the wafer, avoiding the electrodes; a step of forming a chromium layer as wiring from electrodes over the resin layer; and step of forming solder balls as external electrodes on the chromium layer over the resin layer; and a step of cutting the wafer into individual semiconductor chips; in the steps of forming the chromium layer and solder balls, metal thin film fabrication technology is used during the wafer process.

Abstract translation: 其封装尺寸接近其芯片尺寸的半导体器件具有应力吸收层，允许省略图案化的柔性衬底，并且允许同时制造多个部件。 有：在晶片上形成电极的步骤; 在晶片上稍后提供树脂作为应力消除层的步骤，避免了电极; 从树脂层上的电极形成铬层作为布线的步骤; 以及在所述树脂层上的所述铬层上形成作为外部电极的焊球的步骤; 以及将晶片切割成单个半导体芯片的步骤; 在形成铬层和焊球的步骤中，在晶片工艺中使用金属薄膜制造技术。

公开(公告)号：US08080447B2

公开(公告)日：2011-12-20

申请号：US12842080

申请日：2010-07-23

Applicant: Nobuaki Hashimoto

Inventor： Nobuaki Hashimoto

IPC: H01L21/82

CPC classification number: H01L24/81 ,  H01L23/544 ,  H01L2223/54453 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/83191 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A method of manufacturing a semiconductor device, including the following steps, forming a resin layer on a surface of a semiconductor chip, the surface is provided with a bump formed thereon, the resin layer having photosensitivity and adhesiveness, exposing an upper surface of the bump by removing a part of the resin layer right above the bump by exposing and then developing the resin layer, and bonding the semiconductor chip provided with a resin film formed of the resin layer face-down to a substrate, the bump of the semiconductor chip and a conductive section of the substrate being electrically connected by the resin film functioning as an adhesive.

Abstract translation: 一种制造半导体器件的方法，包括以下步骤：在半导体芯片的表面上形成树脂层，所述表面设置有形成在其上的凸起，所述树脂层具有光敏性和粘合性，暴露凸起的上表面 通过使树脂层露出然后显影树脂层，去除树脂层正上方的一部分树脂层，并将设置有由树脂层形成的树脂膜的半导体芯片面朝下地接合到基板，半导体芯片的凸块和 基板的导电部分通过用作粘合剂的树脂膜电连接。

公开(公告)号：US07871858B2

公开(公告)日：2011-01-18

申请号：US12314146

申请日：2008-12-04

Applicant: Nobuaki Hashimoto

Inventor： Nobuaki Hashimoto

IPC: H01L21/00

CPC classification number: H01L24/10 ,  H01L21/486 ,  H01L21/563 ,  H01L23/13 ,  H01L23/16 ,  H01L23/24 ,  H01L23/3114 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/562 ,  H01L24/13 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05548 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/8385 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15151 ,  H01L2924/15183 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/351 ,  H05K1/112 ,  H05K3/3457 ,  H05K3/386 ,  H05K3/4038 ,  H05K2201/0305 ,  H05K2201/0394 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05647 ,  H01L2224/05099 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A method of manufacturing a semiconductor device forms a penetrating hole in a substrate so that the penetrating hole extends from a first surface of the substrate to a second surface of the substrate being opposite to the first surface. An internal wall surface of the penetrating hole has a protrusion formed of a material constituting the substrate, the first surface of the substrate being closer to the protrusion than the second surface. A conductive member is formed on the first surface so that the conductive member covers the penetrating hole. A semiconductor chip is mounted on the first surface so that an electrode of the semiconductor chip is electrically connected to the conductive member. An external electrode is provided through the penetrating hole so that the external electrode is electrically connected to the conductive member and the external electrode projects from the second surface of the substrate.

Abstract translation: 半导体器件的制造方法在基板中形成贯通孔，使得贯通孔从基板的第一面延伸到与第一面相反的基板的第二面。 所述贯通孔的内壁面具有由构成所述基板的材料形成的突起，所述基板的所述第一表面比所述第二表面更靠近所述突起。 导电构件形成在第一表面上，使得导电构件覆盖穿透孔。 半导体芯片安装在第一表面上，使得半导体芯片的电极电连接到导电构件。 通过贯通孔设置外部电极，使得外部电极与导电部件电连接，外部电极从基板的第二面突出。

公开(公告)号：US07780281B2

公开(公告)日：2010-08-24

申请号：US11712364

申请日：2007-02-28

Applicant: Nobuaki Hashimoto

Inventor： Nobuaki Hashimoto

IPC: B41J2/175

CPC classification number: B41J2/17546 ,  B41J2/17566 ,  B41J2002/17579

Abstract: A semiconductor device includes: a semiconductor substrate including an active element formation face on which an active element is formed; detection electrodes detecting a remaining amount of ink by being wet in the ink; an antenna transmitting and receiving information; a storage circuit storing information relating to the ink; and a control circuit controlling the detection electrodes, the antenna, and the storage circuit.

Abstract translation: 半导体器件包括：半导体衬底，其包括形成有源元件的有源元件形成面; 检测电极通过在墨水中湿润来检测墨水的剩余量; 发送和接收信息的天线; 存储与油墨有关的信息的存储电路; 以及控制检测电极，天线和存储电路的控制电路。

公开(公告)号：US07777332B2

公开(公告)日：2010-08-17

申请号：US11583687

申请日：2006-10-19

Applicant: Nobuaki Hashimoto

Inventor： Nobuaki Hashimoto

IPC: H01L23/48

CPC classification number: H01L24/10 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05166 ,  H01L2224/05184 ,  H01L2224/05548 ,  H01L2224/05644 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A semiconductor device including: a semiconductor chip having a rectangular surface on which a plurality of electrodes are formed; a plurality of resin protrusions formed on the surface of the semiconductor chip; and a plurality of interconnects each of which is electrically connected to one of the electrodes and includes an electrical connection section disposed on one of the resin protrusions. At least part of the resin protrusions are disposed in a region near a short side of the surface and extend in a direction which intersects the short side.

Abstract translation: 一种半导体器件，包括：半导体芯片，其上形成有多个电极的矩形表面; 形成在所述半导体芯片的表面上的多个树脂突起; 以及多个互连件，每个互连件电连接到一个电极，并且包括设置在一个树脂突起上的电连接部分。 树脂突起的至少一部分设置在靠近表面的短边的区域中，并且在与短边相交的方向上延伸。

公开(公告)号：US07755261B2

公开(公告)日：2010-07-13

申请号：US12206807

申请日：2008-09-09

Applicant: Nobuaki Hashimoto

Inventor： Nobuaki Hashimoto

IPC: H01L41/09

CPC classification number: H03H9/0519 ,  H03H9/1021 ,  H03H9/215 ,  Y10T29/42

Abstract: An electronic component includes: a functional piece having a predetermined function; a bump electrode formed on the functional piece, the bump electrode including a core with elastic property and a conductive film provided on a surface of the core; and a holding unit for holding a conductive contact state between the bump electrode and a connecting electrode which is electrically conducted to a driving circuit. The electronic component is coupled to the connecting electrode, and elastic deformation of the core causes the conductive film to make conductive contact with the connecting electrode.

Abstract translation: 电子部件包括：具有预定功能的功能件; 形成在所述功能片上的凸块电极，所述凸块电极包括具有弹性的芯和设置在所述芯的表面上的导电膜; 以及保持单元，用于在凸起电极和与驱动电路导电的连接电极之间保持导电接触状态。 电子部件与连接电极连接，芯的弹性变形使导电膜与连接电极导电接触。

公开(公告)号：US07746663B2

公开(公告)日：2010-06-29

申请号：US11480217

申请日：2006-06-30

Applicant: Nobuaki Hashimoto

Inventor： Nobuaki Hashimoto

IPC: H05K7/02 ,  H05K7/06 ,  H05K7/08 ,  H05K7/10

CPC classification number: H01L23/481 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L25/16 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05027 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05548 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05684 ,  H01L2224/16 ,  H01L2924/3011 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00014

Abstract: An electronic substrate is disclosed that includes: a substrate having a first face on which an active region is formed, and a second face on an opposite side to the first face and on which a passive element is formed. The substrate may further include: a penetrative conductive portion penetrating through the substrate; and an electrode formed on the first face, wherein the passive element is electrically connected to the electrode via a penetrative conductive portion.

Abstract translation: 公开了一种电子基板，其包括：具有形成有源区域的第一面的基板和与该第一面相反一侧的第二面，形成有无源元件。 基板还可以包括：穿透基板的穿透导电部分; 以及形成在所述第一面上的电极，其中所述无源元件经由穿透导电部分电连接到所述电极。

公开(公告)号：US07705454B2

公开(公告)日：2010-04-27

申请号：US11500263

申请日：2006-08-07

Applicant: Nobuaki Hashimoto

Inventor： Nobuaki Hashimoto

IPC: H01L21/00

CPC classification number: H01L24/10 ,  H01L24/13 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05184 ,  H01L2224/05548 ,  H01L2224/05644 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A semiconductor device including: a semiconductor chip; a plurality of electrodes formed on the semiconductor chip and arranged along one side of the semiconductor chip; a resin protrusion formed on the semiconductor chip and extending in a direction which intersects the side; and a plurality of electrical connection sections formed on the resin protrusion and electrically connected to the respective electrodes.

Abstract translation: 一种半导体器件，包括：半导体芯片; 形成在所述半导体芯片上并沿着所述半导体芯片的一侧配置的多个电极; 形成在所述半导体芯片上并沿与所述侧面相交的方向延伸的树脂突起; 以及形成在树脂突起上并电连接到各个电极的多个电连接部。