Invention Grant
- Patent Title: Dielectric-filled transmission lines
- Patent Title (中): 介质填充输电线路
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Application No.: US10890054Application Date: 2004-07-13
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Publication No.: US07432776B2Publication Date: 2008-10-07
- Inventor: Herman Kwong , Aneta Wyrzykowska , Larry Marcanti
- Applicant: Herman Kwong , Aneta Wyrzykowska , Larry Marcanti
- Applicant Address: CA St. Laurent, Quebec
- Assignee: Nortel Networks Limited
- Current Assignee: Nortel Networks Limited
- Current Assignee Address: CA St. Laurent, Quebec
- Agency: Anderson Gorecki & Manaras LLP
- Main IPC: H01P3/08
- IPC: H01P3/08

Abstract:
A printed circuit board transmission line has an outer conductive wall surrounding an inner dielectric core. The transmission line may be disposed inside a grounded shielding to provide a form of coaxial conductor that mitigates cross talk from adjacent transmission lines and EMI. Further, groups of dielectric-core transmission lines may be disposed within a single grounded shield. For example, edge coupled differential pairs may be disposed in parallel with each other on a plane defined by a layer of the printed circuit board, i.e., side-by-side. Further, broadside-coupled differential pairs of dielectric-core transmission lines may be disposed in parallel with each other in a stack which is orthogonal with the plane defined by a layer of the printed circuit board, i.e., one on top of the other. Further, a plurality of dielectric-core transmission lines which may include all or ones of single-ended lines and differential pairs may be disposed within a single grounded shield.
Public/Granted literature
- US20060012452A1 Dielectric-filled transmission lines Public/Granted day:2006-01-19
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