公开(公告)号：US09501514B2

公开(公告)日：2016-11-22

申请号：US12879222

申请日：2010-09-10

Applicant: Marni Gasn ,  Herman Kwong

Inventor： Marni Gasn ,  Herman Kwong

IPC: G06F3/0481 ,  G06F3/0482 ,  G06F3/0483 ,  G06Q10/10 ,  G06F17/30

Abstract: Systems and methods for implementing customized drop-down menus in user interface displays. Drop-down menus include one or more selection options and a table having multiple fields. Drop-down menu items are particularly useful for assisting a user with assigning information synchronized into a target database from one database system, such as an Outlook file, to objects in the target database system, such as a multi-tenant database system as well as providing suggestions to the user from search results when they may want to choose one of those results or perform a different action altogether.

公开(公告)号：US09304614B2

公开(公告)日：2016-04-05

申请号：US12982679

申请日：2010-12-30

Applicant: Herman Kwong

Inventor： Herman Kwong

IPC: G06F3/038 ,  G06F3/0481 ,  G06Q50/00 ,  G06F3/0484 ,  G06F9/44

CPC classification number: G06F9/453 ,  G06F3/038 ,  G06F3/0481 ,  G06F3/0482 ,  G06F3/0484 ,  G06F3/04842 ,  G06F9/451 ,  G06F2203/0383 ,  G06Q50/01 ,  H04L51/32 ,  H04L67/42

Abstract: Systems and methods for providing a custom action for an information post are described. In one embodiment, data for generating a user interface component for display at a client machine may be transmitted from a server to the client machine. The user interface component displaying one or more information posts may be capable of being generated in accordance with first computing programming language instructions provided by a first entity. Each information post may include information relating to a record stored on a storage medium accessible to the server. Selected ones of the information posts may have associated therewith a custom action activation mechanism for activating a custom action relating to the associated information post. The custom action activation mechanism may be capable of being generated in accordance with second computer programming language instructions provided by a second entity.

Abstract translation: 描述了为信息帖子提供自定义操作的系统和方法。 在一个实施例中，用于生成用于在客户机上显示的用户界面组件的数据可以从服务器发送到客户端机器。 可以根据由第一实体提供的第一计算编程语言指令来生成显示一个或多个信息帖子的用户界面组件。 每个信息帖子可以包括与存储在服务器可访问的存储介质上的记录有关的信息。 所选择的信息帖子可以与其相关联的自定义动作激活机构用于激活与相关联的信息帖子有关的自定义动作。 可以根据由第二实体提供的第二计算机编程语言指令来生成自定义动作激活机制。

公开(公告)号：US09195724B2

公开(公告)日：2015-11-24

申请号：US13369858

申请日：2012-02-09

Applicant: Ganesh Mathrubootham ,  Qian Lu ,  Lu Ping Chen ,  Shahid H. Khatri ,  Hui Fung Herman Kwong ,  Kayvaan Ghassemieh

Inventor： Ganesh Mathrubootham ,  Qian Lu ,  Lu Ping Chen ,  Shahid H. Khatri ,  Hui Fung Herman Kwong ,  Kayvaan Ghassemieh

IPC: G06F3/048 ,  G06F17/30

CPC classification number: G06F17/30557 ,  G06F3/048

Abstract: Methods and systems are provided for associating objects in a database. An exemplary method involves identifying one or more objects in the database that are likely to be related to a first object in the database that is based on data obtained from a local application associated with a user and displaying the identified objects on a client device associated with the user. In exemplary embodiments, the identified objects are displayed in response to selection of a graphical user interface element enabling indication of a second object from among the one or more objects, wherein the first object is associated with the second object in the database after receiving indication of the second object. In one or more exemplary embodiments, the database is a multi-tenant database in a multi-tenant system providing instances of a virtual application to multiple tenants.

Abstract translation: 提供了方法和系统用于关联数据库中的对象。 一种示例性方法包括识别数据库中可能与数据库中的第一对象相关的一个或多个对象，其基于从与用户相关联的本地应用获得的数据，并且在与客户端设备相关联的客户端设备上显示所识别的对象 用户。 在示例性实施例中，响应于选择可以从一个或多个对象中指示第二对象的图形用户界面元素来显示所识别的对象，其中在接收到指示之后，第一对象与数据库中的第二对象相关联 第二个对象。 在一个或多个示例性实施例中，数据库是多租户系统中的多租户数据库，向多个租户提供虚拟应用的实例。

公开(公告)号：US20090201654A1

公开(公告)日：2009-08-13

申请号：US12367635

申请日：2009-02-09

Applicant: Lambert SIMONOVICH ,  Herman Kwong

Inventor： Lambert SIMONOVICH ,  Herman Kwong

IPC: H05K1/14 ,  H05K3/36

CPC classification number: H05K1/024 ,  H05K1/0219 ,  H05K3/4046 ,  H05K3/429 ,  H05K3/4611 ,  H05K2201/0187 ,  H05K2201/09809 ,  H05K2201/10303 ,  H05K2201/1059 ,  H05K2203/063 ,  Y10T29/49165

Abstract: A method and system for reducing via hole parasitic effects on PCB transmission channels. In order to reduce the effects of excess via capacitance in PCB structures, PCB via modeling accuracy for high speed serial data transmissions is improved by utilizing lower permittivity reinforcement and z-axis conducting methods. A method to accomplish this includes creating a channel within the circuit board to accommodate a via hole, filling the created channel with a predetermined amount of dielectric material, forming the via hole, and electrically coupling the top layer of the structure to at least an inner signal substrate layer of the structure.

Abstract translation: 减少PCB传输通道的通孔寄生效应的方法和系统。 为了减少PCB结构中过剩电容的影响，通过利用较低的介电常数增强和z轴传导方法，可以提高PCB通过高速串行数据传输的建模精度。 实现这一目的的方法包括在电路板内形成通道以容纳通孔，用预定量的介电材料填充所产生的通道，形成通孔，以及将结构的顶层电耦合到至少内部 信号基底层的结构。

公开(公告)号：US07348494B1

公开(公告)日：2008-03-25

申请号：US09821722

申请日：2001-03-29

Applicant: Martin R. Handforth ,  Herman Kwong ,  Richard R. Goulette

Inventor： Martin R. Handforth ,  Herman Kwong ,  Richard R. Goulette

IPC: H05K1/16

CPC classification number: H05K3/368 ,  H01R12/52 ,  H01R12/61 ,  H05K1/0218 ,  H05K1/117 ,  H05K3/365 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/0715 ,  H05K2201/0919 ,  H05K2201/10598

Abstract: Inner layer traces on a multilayer printed wiring board are exposed to enable direct interconnection with another device such as a printed wiring board. The traces may be exposed by removing at least some of the dielectric substrate material around the traces, or by extending the traces beyond the other layers of the printed wiring board. Corresponding conductors associated with the other device are placed in direct physical contact with the exposed inner layer traces, and may be aligned and secured with guide plates, alignment pins and spring members. Such direct connection mitigates the need for vias, and has more favorable electrical characteristics for high frequency signal transmission.

Abstract translation: 暴露多层印刷线路板上的内层迹线，以便能够与诸如印刷电路板的其它器件直接互连。 可以通过去除迹线周围的至少一些电介质基板材料，或者通过将迹线延伸超过印刷线路板的其它层来暴露迹线。 与另一装置相关联的相应的导体被放置成与暴露的内层迹线直接物理接触，并且可以与引导板，对准销和弹簧构件对准和固定。 这种直接连接减轻了对通孔的需要，并且对于高频信号传输具有更有利的电特性。

公开(公告)号：US20060012452A1

公开(公告)日：2006-01-19

申请号：US10890054

申请日：2004-07-13

Applicant: Herman Kwong ,  Aneta Wyrzykowska ,  Larry Marcanti

Inventor： Herman Kwong ,  Aneta Wyrzykowska ,  Larry Marcanti

IPC: H01P3/08 ,  H01P3/06

CPC classification number: H05K1/0221 ,  H01P3/06 ,  H01P5/183 ,  H05K1/024 ,  H05K2201/09672 ,  H05K2201/09809 ,  H05K2201/09981

Abstract: A printed circuit board transmission line has an outer conductive wall surrounding an inner dielectric core. The transmission line may be disposed inside a grounded shielding to provide a form of coaxial conductor that mitigates cross talk from adjacent transmission lines and EMI. Further, groups of dielectric-core transmission lines may be disposed within a single grounded shield. For example, edge coupled differential pairs may be disposed in parallel with each other on a plane defined by a layer of the printed circuit board, i.e., side-by-side. Further, broadside-coupled differential pairs of dielectric-core transmission lines may be disposed in parallel with each other in a stack which is orthogonal with the plane defined by a layer of the printed circuit board, i.e., one on top of the other. Further, a plurality of dielectric-core transmission lines which may include all or ones of single-ended lines and differential pairs may be disposed within a single grounded shield.

Abstract translation: 印刷电路板传输线具有围绕内部介质芯的外部导电壁。 传输线可以设置在接地屏蔽内，以提供一种形式的同轴导体，其减轻了来自相邻传输线的串扰和EMI。 此外，介质芯传输线组可以设置在单个接地屏蔽内。 例如，边缘耦合差动对可以在由印刷电路板的层（即并排）限定的平面上彼此平行地设置。 此外，介质芯传输线的宽侧耦合差分对可以彼此平行地布置在与由印刷电路板的层（即，一个在另一个上面）限定的平面正交的堆叠中。 此外，可以包括单端线路和差分对线路中的全部或者多条的多个介质芯线传输线路设置在单个接地屏蔽层内。

公开(公告)号：US20050257958A1

公开(公告)日：2005-11-24

申请号：US11189999

申请日：2005-07-27

Applicant: Aneta Wyrzykowska ,  Herman Kwong ,  Luigi Difilippo

Inventor： Aneta Wyrzykowska ,  Herman Kwong ,  Luigi Difilippo

IPC: H05K1/11 ,  H05K3/30 ,  H05K3/46

CPC classification number: H05K1/112 ,  H01L2224/14 ,  H01L2224/17 ,  H01L2924/00014 ,  H05K3/303 ,  H05K3/4623 ,  H05K2201/09472 ,  H05K2201/09518 ,  H05K2201/09536 ,  H05K2201/10318 ,  H05K2201/10424 ,  H05K2201/10659 ,  H05K2201/10704 ,  H05K2201/10734 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/49139 ,  Y10T29/49147 ,  Y10T29/49165 ,  H01L2224/0401

Abstract: A method for implementing a circuit component on a surface of a multilayer circuit board is provided. The circuit component includes a plurality of pins and the circuit board includes a plurality of electrically conductive vias penetrating at least one layer of the circuit board and being arranged so as to form at least one channel for routing one or more traces at one or more signal layers of the circuit board. The method comprises the step of forming at least one pin of the plurality of pins of the circuit component to have a length compatible with a depth of a corresponding via of the circuit board.

公开(公告)号：US06949991B1

公开(公告)日：2005-09-27

申请号：US10420734

申请日：2003-04-23

Applicant: Martin R. Handforth ,  Herman Kwong ,  Richard R. Goulette

Inventor： Martin R. Handforth ,  Herman Kwong ,  Richard R. Goulette

IPC: H01P3/08 ,  H05K1/00 ,  H05K1/02

CPC classification number: H01P3/085 ,  H01P3/088 ,  H05K1/0218 ,  H05K1/024 ,  H05K1/0298 ,  H05K2201/0715

Abstract: A technique for facilitating signal transmission at high signal frequencies in a multi-layer substrate is disclosed. In one embodiment a multi-layer substrate comprises a conductor or pair of conductors, a first dielectric layer on a first side of the conductor or pair of conductors and a second dielectric layer on a second side of the conductor or pair of conductors. An air channel is provided in the first dielectric layer, the air channel formed to be substantially coextensive with the conductor or pair of conductors. A conductive shield surrounds the conductor or pair of conductors, the first dielectric layer, and the second dielectric layer in order to eliminate crosstalk. The conductor or pair of conductors may have discrete spaced edges and the width of the conductor or pair of conductors may be increased in order to adjust the impedance because of the low dielectric constant of air. Furthermore, additional air channels and a supporting layer may be included in the structure.

Abstract translation: 公开了一种用于促进多层基板中的高信号频率的信号传输的技术。 在一个实施例中，多层衬底包括导体或一对导体，在导体或一对导体的第一侧上的第一介电层和在导体或导体对的一对导体的第二侧上的第二介电层。 空气通道设置在第一电介质层中，空气通道形成为与导体或一对导体基本共同延伸。 导电屏蔽围绕导体或一对导体，第一介电层和第二介电层，以消除串扰。 导体或导体对可以具有离散的间隔边缘，并且由于空气的低介电常数，可以增加导体或导线对的宽度以调整阻抗。 此外，结构中可以包括附加的空气通道和支撑层。

公开(公告)号：US06528737B1

公开(公告)日：2003-03-04

申请号：US09639075

申请日：2000-08-16

Applicant: Herman Kwong ,  Richard R. Goulette

Inventor： Herman Kwong ,  Richard R. Goulette

IPC: H01R1204

CPC classification number: H05K1/114 ,  H01R12/52 ,  H05K1/14 ,  H05K3/4602 ,  H05K2201/09509 ,  H05K2201/09627 ,  H05K2203/1572

Abstract: A midplane board adapted for use in an electronic equipment shelf is provided. The midplane board includes a first surface having a plurality of contact elements adapted to engage corresponding contact elements on a first circuit board. The midplane board also includes a second surface in opposite relationship with the first surface. The second surface has a plurality of contact elements adapted to engage corresponding contact elements on a second circuit board in such a manner that at least a portion of a side of the first circuit board is opposed to at least a portion of a side of the second circuit board. The midplane includes at least one signal connection path including a buried via suitable for establishing a connection between a contact element on the first surface and a contact element on the second surface. The contact elements on the first surface define a first pattern while the contact elements on the second surface define a second pattern. The midplane board also includes an intersect area where at least a portion of the first pattern is opposite to at least a portion of the second pattern. The intersect area comprises a set of signal connection paths between the first pattern and the second pattern which define a certain pattern tile having a symmetrical layout along a given axis.

Abstract translation: 提供了适用于电子设备架的中面板。 中平面板包括具有适于接合第一电路板上的对应接触元件的多个接触元件的第一表面。 中平面板还包括与第一表面相反关系的第二表面。 第二表面具有多个接触元件，其适于接合第二电路板上的对应的接触元件，使得第一电路板的一侧的至少一部分与第二电路板的一侧的至少一部分相对 电路板。 中间平面包括至少一个信号连接路径，其包括适于建立第一表面上的接触元件与第二表面上的接触元件之间的连接的埋入通孔。 第一表面上的接触元件限定第一图案，而第二表面上的接触元件限定第二图案。 中平面板还包括交叉区域，其中第一图案的至少一部分与第二图案的至少一部分相对。 相交区域包括在第一图案和第二图案之间的一组信号连接路径，其限定沿着给定轴线具有对称布局的特定图案瓦片。

公开(公告)号：US06487083B1

公开(公告)日：2002-11-26

申请号：US09636595

申请日：2000-08-10

Applicant: Herman Kwong

Inventor： Herman Kwong

IPC: H05K706

CPC classification number: H05K1/183 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/0298 ,  H05K1/186 ,  Y10T29/4913 ,  Y10T29/49165 ,  H01L2924/00014

Abstract: A technique for improving electrical signal performance in multilayer circuit boards by eliminating the need for electrically conductive vias is disclosed. In one embodiment, the technique is realized as an improved multilayer circuit board having an electrically conductive signal layer disposed beneath at least one dielectric layer. The improvement comprises a cavity in the multilayer circuit board extending through the at least one dielectric layer so as to expose at least a portion of the electrically conductive signal layer within the cavity. The cavity is sized to accommodate an electronic component therein such that the electronic component makes electrical contact with the exposed portion of the electrically conductive signal layer, thereby eliminating the need for an electrically conductive via electrically connected to the electrically conductive signal layer and formed through the at least one dielectric layer or any other layer of the multilayer circuit board.

Abstract translation: 公开了一种通过消除对导电通孔的需要来改善多层电路板中的电信号性能的技术。 在一个实施例中，该技术被实现为具有设置在至少一个电介质层下方的导电信号层的改进的多层电路板。 该改进包括多层电路板中的延伸穿过至少一个电介质层的空腔，以便露出腔内的导电信号层的至少一部分。 空腔的尺寸适于容纳其中的电子部件，使得电子部件与导电信号层的暴露部分电接触，由此不需要电连接到导电信号层的导电通孔，并且通过 至少一个电介质层或多层电路板的任何其它层。