A method of using a blade probe for probing a node of a circuit where the node includes a pad surface surrounding a node hole is disclosed. A probe having a longitudinal probe axis, a shaft, and a probe blade is provided. The shaft is generally concentric to the longitudinal probe axis and is made from an electrically conductive material. A probe blade is disposed at a first end of the shaft. The probe blade includes first and second faces positioned about the longitudinal probe axis in facing opposition to each other. The first and second faces converge towards each other and terminate at an edge. The probe is urged in a direction generally parallel to the longitudinal probe axis to create at least one electrical contact point between the edge of the probe blade and one of the solder disposed a pad surface of a node or the solder disposed on a rim of a hole of the node. Electrical coupling is established between the probe and the node via the at least one electrical contact point and the node is electrically evaluated.