Invention Grant
- Patent Title: Compact optical sub-assembly with ceramic package
- Patent Title (中): 紧凑型光电子组件，带陶瓷封装
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Application No.: US11046939Application Date: 2005-01-31
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Publication No.: US07476040B2Publication Date: 2009-01-13
- Inventor: Jeffrey Zack , Craig A. Young , Anand Shukla , Wei Xu , William K. Hogan , David Peter Gaio , Chris Hart , Philip Deane , Mark J. Bailey , Martin A. Helfand
- Applicant: Jeffrey Zack , Craig A. Young , Anand Shukla , Wei Xu , William K. Hogan , David Peter Gaio , Chris Hart , Philip Deane , Mark J. Bailey , Martin A. Helfand
- Applicant Address: US CA Milpitas
- Assignee: JDS Uniphase Corporation
- Current Assignee: JDS Uniphase Corporation
- Current Assignee Address: US CA Milpitas
- Agency: Allen, Dyer, Doppelt Milbrath & Gilchrist, P.A.
- Main IPC: G02B6/42
- IPC: G02B6/42
Abstract:
The present invention relates to an optical sub-assembly, i.e. a receiver optical subassembly or a transmitter optical sub-assembly, for use in an optical transceiver device. The optical sub-assembly according to the present invention includes a hermetic ceramic package with a multi-layer ceramic structure providing a unique RF signal and ground structure providing a controlled signal impedance to achieve high signal transmission quality.
Public/Granted literature
- US20050185882A1 Compact optical sub-assembly with ceramic package Public/Granted day:2005-08-25
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