Invention Grant
- Patent Title: Release layer paste and method of production of a multilayer type electronic device
- Patent Title (中): 剥离层糊剂和多层型电子器件的制造方法
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Application No.: US11200184Application Date: 2005-08-10
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Publication No.: US07604858B2Publication Date: 2009-10-20
- Inventor: Kyotaro Abe , Tamotsu Ishiyama , Shigeki Sato
- Applicant: Kyotaro Abe , Tamotsu Ishiyama , Shigeki Sato
- Applicant Address: JP Tokyo
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2004-233634 20040810; JP2005-202093 20050711
- Main IPC: C08B29/00
- IPC: C08B29/00 ; B05D5/00 ; B05D3/02 ; B32B18/00

Abstract:
A release layer paste used for producing a multilayer electronic device, used in combination with an electrode layer paste including terpineol, dehydroterpineol, terpineol acetate, or dehydroterpineol acetate and including a ceramic powder, organic vehicle, plasticizer, and dispersion agent, the organic vehicle containing a binder having polyvinyl acetal as its main ingredient, a ratio (P/B) of the ceramic powder and the binder and plasticizer being controlled to 1.33 to 5.56 (however, excluding 5.56).
Public/Granted literature
- US20060035072A1 Release layer paste and method of production of a multilayer type electronic device Public/Granted day:2006-02-16
Information query