Invention Grant
- Patent Title: Electronic component transporting method
- Patent Title (中): 电子元器件输送方式
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Application No.: US11701502Application Date: 2007-02-02
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Publication No.: US07640654B2Publication Date: 2010-01-05
- Inventor: Seiichi Nakatani , Seiji Karashima , Takashi Kitae
- Applicant: Seiichi Nakatani , Seiji Karashima , Takashi Kitae
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2006-025443 20060202
- Main IPC: H05K3/30
- IPC: H05K3/30

Abstract:
A pickup device comprising a pickup surface to which an electronic component retaining liquid is to be applied and capable of adjusting a wet area of the electronic component retaining liquid on the pickup surface is prepared, and the electronic component retaining liquid is applied to the pickup surface in a first step. The electronic component is retained on the pickup surface via the electronic component retaining liquid in a state where the wet area is extended in a second step.
Public/Granted literature
- US20070175024A1 Electronic component transporting method Public/Granted day:2007-08-02
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