Invention Grant
US07640659B2 Method for forming conductive pattern and wiring board 有权
形成导电图案和布线板的方法

Method for forming conductive pattern and wiring board
Abstract:
[Problem] To provide a conductive pattern formation method in which a fine pattern can be formed in a simple way at low cost.[Means for Solving Problem] A flat plate having a convex pattern on its surface is provided so as to oppose a substrate, a fluid body including conductive particles and a gas bubble generating agent is supplied into a gap between the substrate and the flat plate, and thereafter, the fluid body is heated for generating gas bubbles from the gas bubble generating agent included in the fluid body. The fluid body is forced out of the gas bubbles as the gas bubbles generated from the gas bubble generating agent grow, so as to self-assemble between the convex pattern formed on the flat plate and the substrate owing to interfacial force, and an aggregate of the conductive particles included in the fluid body having self-assembled is made into a conductive pattern formed on the substrate.
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