Invention Grant
- Patent Title: Method for forming conductive pattern and wiring board
- Patent Title (中): 形成导电图案和布线板的方法
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Application No.: US12064131Application Date: 2005-08-11
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Publication No.: US07640659B2Publication Date: 2010-01-05
- Inventor: Seiji Karashima , Takashi Kitae , Seiichi Nakatani
- Applicant: Seiji Karashima , Takashi Kitae , Seiichi Nakatani
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2005-254773 20050902
- International Application: PCT/JP2006/315956 WO 20050811
- International Announcement: WO2007/029452 WO 20070315
- Main IPC: H05K3/02
- IPC: H05K3/02 ; H05K3/10

Abstract:
[Problem] To provide a conductive pattern formation method in which a fine pattern can be formed in a simple way at low cost.[Means for Solving Problem] A flat plate having a convex pattern on its surface is provided so as to oppose a substrate, a fluid body including conductive particles and a gas bubble generating agent is supplied into a gap between the substrate and the flat plate, and thereafter, the fluid body is heated for generating gas bubbles from the gas bubble generating agent included in the fluid body. The fluid body is forced out of the gas bubbles as the gas bubbles generated from the gas bubble generating agent grow, so as to self-assemble between the convex pattern formed on the flat plate and the substrate owing to interfacial force, and an aggregate of the conductive particles included in the fluid body having self-assembled is made into a conductive pattern formed on the substrate.
Public/Granted literature
- US20090133901A1 METHOD FOR FORMING CONDUCTIVE PATTERN AND WIRING BOARD Public/Granted day:2009-05-28
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