Invention Grant
- Patent Title: Electronic substrate manufacturing method
- Patent Title (中): 电子基板制造方法
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Application No.: US11480216Application Date: 2006-06-30
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Publication No.: US07645706B2Publication Date: 2010-01-12
- Inventor: Nobuaki Hashimoto
- Applicant: Nobuaki Hashimoto
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2005-198493 20050707
- Main IPC: H01L21/302
- IPC: H01L21/302
Abstract:
An electronic substrate manufacturing method includes: forming a wiring pattern on a substrate; providing a mask with an opening for the substrate on which the wiring pattern has been formed; performing a specified treatment in a part area of the wiring pattern through the opening of the mask. The opening has a size based on an accuracy of an alignment between the substrate and the mask.
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