Invention Grant
US07648756B2 Coating for enhancing low temperature heat sealability and high hot tack to polymeric substrates
有权
用于提高低温热封性和对聚合物基材的高热粘性的涂层
- Patent Title: Coating for enhancing low temperature heat sealability and high hot tack to polymeric substrates
- Patent Title (中): 用于提高低温热封性和对聚合物基材的高热粘性的涂层
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Application No.: US11546672Application Date: 2006-10-12
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Publication No.: US07648756B2Publication Date: 2010-01-19
- Inventor: Robin Cooper
- Applicant: Robin Cooper
- Applicant Address: US OH Cincinnati
- Assignee: Michelman, Inc.
- Current Assignee: Michelman, Inc.
- Current Assignee Address: US OH Cincinnati
- Agency: Dinsmore & Shohl LLP
- Main IPC: B32B27/32
- IPC: B32B27/32 ; B32B5/16 ; B32B27/00 ; B32B27/08 ; B05D3/02

Abstract:
A coating is provided for enhancing low temperature heat sealability and providing high hot tack to polymeric substrates. The coating is water-based and includes a dispersion of a copolymer of ethylene and acrylic or methacrylic acid, and a compatible adhesion enhancer which is an aliphatic polyurethane emulsion. The coating may also include additives such as wetting agents, matting agents, antiblocking agents, and tackifying resins. The coating may be applied to a variety of polymeric substrates and may be heat sealed to itself, or to polymeric substrates, cellulosic substrates, and metal substrates.
Public/Granted literature
- US20070087189A1 Coating for enhancing low temperature heat sealability and high hot tack to polymeric substrates Public/Granted day:2007-04-19
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