Invention Grant
- Patent Title: Release layer paste and method of production of a multilayer type electronic device
- Patent Title (中): 剥离层糊剂和多层型电子器件的制造方法
-
Application No.: US11702632Application Date: 2007-02-06
-
Publication No.: US07651764B2Publication Date: 2010-01-26
- Inventor: Kyotaro Abe , Shigeki Sato
- Applicant: Kyotaro Abe , Shigeki Sato
- Applicant Address: JP Tokyo
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2006-034171 20060210
- Main IPC: C08B29/00
- IPC: C08B29/00 ; B05D5/00 ; B05D3/02

Abstract:
A release layer paste used for producing a multilayer type electronic device and forming a release layer of a thickness of 0.05 to 0.1 μm, used in combination with an electrode layer paste including one or more solvents selected from limonene, dihydroterpinyl methyl ether, α-terpinyl acetate, terpinyl methyl ether, isobornyl acetate, caryophyllene, 1-dihydrocarvyl acetate, menthone, menthyl acetate, perillyl acetate, carvyl acetate, d-dihydrocarvyl acetate, and butyl carbitol acetate and a binder comprised of ethyl cellulose, including a ceramic powder, organic vehicle, plasticizer, and dispersion agent, the organic vehicle containing a binder having polyvinyl acetal as its main ingredient, a ratio (P/B) of the ceramic powder with respect to the binder and plasticizer being controlled to 1.33 to 5.56 (however, excluding 5.56).
Public/Granted literature
- US20070190251A1 Release layer paste and method of production of a multilayer type electronic device Public/Granted day:2007-08-16
Information query