Invention Grant
- Patent Title: Ion acceleration column connection mechanism with integrated shielding electrode and related methods
- Patent Title (中): 具有集成屏蔽电极的离子加速柱连接机构及相关方法
-
Application No.: US11693237Application Date: 2007-03-29
-
Publication No.: US07655928B2Publication Date: 2010-02-02
- Inventor: Kasegn D. Tekletsadik
- Applicant: Kasegn D. Tekletsadik
- Applicant Address: US MA Gloucester
- Assignee: Varian Semiconductor Equipment Associates, Inc.
- Current Assignee: Varian Semiconductor Equipment Associates, Inc.
- Current Assignee Address: US MA Gloucester
- Main IPC: H01J27/00
- IPC: H01J27/00 ; H01J37/317 ; H01J27/06 ; H01J27/10 ; G21F3/00 ; A61N5/00

Abstract:
Ion accelerating devices including connection mechanisms with integrated shielding electrode and related methods are disclosed. According to an embodiment, an ion accelerating device of an ion implantation system comprises: a first element; a first connection system within the first element, the first connection system including a first connector and a first encapsulated shielding electrode around the first connector; and a second connection system within a second element other than the first element, the second connection system being coupled to the first connector; wherein the first encapsulated shielding electrode includes a first shielding portion adjacent to a first interface surface of the first element where the second connection system interfaces with the first element, in a cross-sectional view, the first shielding portion being substantially U-shaped.
Public/Granted literature
- US20080238326A1 ION ACCELERATION COLUMN CONNECTION MECHANISM WITH INTEGRATED SHIELDING ELECTRODE AND RELATED METHODS Public/Granted day:2008-10-02
Information query