Invention Grant
US07656183B2 Method to extract gate to source/drain and overlap capacitances and test key structure therefor
有权
提取门到源/漏极和重叠电容的方法,并测试其关键结构
- Patent Title: Method to extract gate to source/drain and overlap capacitances and test key structure therefor
- Patent Title (中): 提取门到源/漏极和重叠电容的方法,并测试其关键结构
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Application No.: US12016197Application Date: 2008-01-17
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Publication No.: US07656183B2Publication Date: 2010-02-02
- Inventor: Yu-Hao Hsu , Kuo-Liang Yeh
- Applicant: Yu-Hao Hsu , Kuo-Liang Yeh
- Applicant Address: TW Hsin-Chu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Main IPC: G01R31/26
- IPC: G01R31/26

Abstract:
A method to extract gate to source/drain and overlap capacitances is disclosed. A first capacitance of a first test key having a reference structure and a second capacitance of a second test key having a novel structure are measured. The second test key may comprise at least a gate formed on an insulation structure, at least a contact formed on the insulation structure aside, and a metal layer formed on the contact. Another embodiment of the second test key may comprise at least a gate formed on the semiconductor substrate, a contact formed aside, and a metal layer formed on the contact. Further another embodiment uses a test key comprising at least an elongated gate and an elongated doping region aside, and only one or a few contacts are formed on an end portion of the elongated doping region.
Public/Granted literature
- US20090184316A1 Method to extract gate to source/drain and overlap capacitances and test key structure therefor Public/Granted day:2009-07-23
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