Invention Grant
- Patent Title: Image-sensing module of image capture apparatus and manufacturing method thereof
- Patent Title (中): 图像捕获装置的图像感测模块及其制造方法
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Application No.: US11693743Application Date: 2007-03-30
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Publication No.: US07659501B2Publication Date: 2010-02-09
- Inventor: Min-Chih Hsuan , Tsung-Hsi Ko , Li-Che Chen
- Applicant: Min-Chih Hsuan , Tsung-Hsi Ko , Li-Che Chen
- Applicant Address: TW Hsinchu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Hsinchu
- Agency: Jianq Chyun IP Office
- Main IPC: H01J3/14
- IPC: H01J3/14 ; H01J5/16
Abstract:
An image-sensing module is provided. The image-sensing module includes a substrate, a plurality of image-sensing units, a plurality of micro lenses and a focusing unit. The image-sensing units are disposed on the substrate and the micro lenses are respectively disposed on one of the image-sensing units. The focusing unit is disposed on the substrate and covers the micro lenses. A top surface of the focusing unit is a curved surface. Furthermore, a method of manufacturing the image-sensing module and an image capture apparatus are provided.
Public/Granted literature
- US20080239120A1 IMAGE-SENSING MODULE AND MANUFACTURING METHOD THEREOF, AND IMAGE CAPTURE APPARATUS Public/Granted day:2008-10-02
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