Invention Grant
- Patent Title: Method for measuring dimensions of sample and scanning electron microscope
- Patent Title (中): 测量样品和扫描电子显微镜尺寸的方法
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Application No.: US10450852Application Date: 2002-03-27
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Publication No.: US07659508B2Publication Date: 2010-02-09
- Inventor: Osamu Nasu , Tadashi Otaka , Hiroki Kawada , Ritsuo Fukaya , Makoto Ezumi
- Applicant: Osamu Nasu , Tadashi Otaka , Hiroki Kawada , Ritsuo Fukaya , Makoto Ezumi
- Applicant Address: JP Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Dickstein Shapiro LLP
- Priority: JP2001-259126 20010829
- International Application: PCT/JP02/02983 WO 20020327
- International Announcement: WO03/021186 WO 20030313
- Main IPC: H01J37/28
- IPC: H01J37/28 ; G01N23/225

Abstract:
The present invention suppresses decreases in the volumes of the patterns which have been formed on the surfaces of semiconductor samples or of the like, or performs accurate length measurements, irrespective of such decreases. In an electrically charged particle ray apparatus by which the line widths and other length data of the patterns formed on samples are to be measured by scanning the surface of each sample with electrically charged particle rays and detecting the secondary electrons released from the sample, the scanning line interval of said electrically charged particle rays is set so as not to exceed the irradiation density dictated by the physical characteristics of the sample. Or measured length data is calculated from prestored approximation functions.
Public/Granted literature
- US20040051040A1 Method for measuring dimensions of sample and scanning electron microscope Public/Granted day:2004-03-18
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