A contact device is provided, the device having at least a first contact region for electrical connection to an electric line and at least a second contact region for electrical connection to a flexible printed circuit board other contact medium which may damaged by repeated soldering. The first contact region and the second contact region are electrically connected. Between the first contact region and the second contact region, a third region is provided which has a lower thermal conductivity per unit length than the first contact region and/or the second contact region.