Invention Grant
- Patent Title: Integrated circuit chip with seal ring structure
- Patent Title (中): 集成电路芯片采用密封圈结构
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Application No.: US12207490Application Date: 2008-09-09
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Publication No.: US07667302B1Publication Date: 2010-02-23
- Inventor: Tien-Chang Chang , Shi-Bai Chen , Tao Cheng
- Applicant: Tien-Chang Chang , Shi-Bai Chen , Tao Cheng
- Applicant Address: TW Hsin-Chu
- Assignee: Mediatek Inc.
- Current Assignee: Mediatek Inc.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Main IPC: H01L23/552
- IPC: H01L23/552

Abstract:
An integrated circuit chip includes an analog and/or RF circuit block, a digital circuit, and a seal ring structure surrounding and protecting the analog and/or RF circuit block. The seal ring structure comprises a continuous outer seal ring, and a discontinuous inner seal ring divided into at least a first portion and a second portion. The second portion is situated in front of the analog and/or RF circuit block for shielding a noise from interfering the analog and/or RF circuit block.
Public/Granted literature
- US20100059867A1 INTEGRATED CIRCUIT CHIP WITH SEAL RING STRUCTURE Public/Granted day:2010-03-11
Information query
IPC分类: