Invention Grant
- Patent Title: Light emitting device, method of manufacturing light emitting device, and electronic apparatus
- Patent Title (中): 发光器件,制造发光器件的方法和电子设备
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Application No.: US11332255Application Date: 2006-01-17
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Publication No.: US07667395B2Publication Date: 2010-02-23
- Inventor: Kenji Hayashi
- Applicant: Kenji Hayashi
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2005-008696 20050117; JP2005-353029 20051207
- Main IPC: H01J1/62
- IPC: H01J1/62 ; H01J63/04

Abstract:
A light emitting device includes on a base member: a plurality of first electrodes; a barrier wall having a plurality of opening portions corresponding to the plurality of first electrodes; organic functional layers disposed in the opening portions; a second electrode covering the barrier wall and the organic functional layers; an organic buffer layer covering the second electrode; a gas barrier layer disposed to cover patterns of the organic buffer layer and surroundings thereof; and an outside reinforcing layer disposed to cover the outer circumferential region of the organic buffer layer.
Public/Granted literature
- US20060158108A1 Light emitting device, method of manufacturing light emitting device, and electronic apparatus Public/Granted day:2006-07-20
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