Invention Grant
- Patent Title: Method and apparatus for coating of substrates
- Patent Title (中): 用于涂布基材的方法和装置
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Application No.: US11539443Application Date: 2006-10-06
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Publication No.: US07669548B2Publication Date: 2010-03-02
- Inventor: Ralph A. Chappa
- Applicant: Ralph A. Chappa
- Applicant Address: US MN Eden Prairie
- Assignee: SurModics, Inc.
- Current Assignee: SurModics, Inc.
- Current Assignee Address: US MN Eden Prairie
- Agency: Pauly, Devries Smith & Deffner, L.L.C.
- Main IPC: B05B15/04
- IPC: B05B15/04 ; B05C5/00

Abstract:
The invention relates to methods and apparatuses that reduce problems encountered during coating of a device, such as a medical device having a cylindrical shape. In an embodiment, the invention includes an apparatus including a bi-directional rotation member. In an embodiment, the invention includes a method with a bi-directional indexing movement. In an embodiment, the invention includes a coating solution supply member having a major axis oriented parallel to a gap between rollers on a coating apparatus. In an embodiment, the invention includes a device retaining member. In an embodiment, the invention includes an air nozzle or an air knife. In an embodiment, the invention includes a method including removing a static charge from a small diameter medical device.
Public/Granted literature
- US20070101933A1 Method and Apparatus for Coating of Substrates Public/Granted day:2007-05-10
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