Invention Grant
- Patent Title: Semiconductor light emitting device, light emitting module, lighting apparatus, display element and manufacturing method of semiconductor light emitting device
- Patent Title (中): 半导体发光元件，发光模块，照明装置，显示元件及半导体发光元件的制造方法
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Application No.: US10567510Application Date: 2004-08-09
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Publication No.: US07675075B2Publication Date: 2010-03-09
- Inventor: Hideo Nagai
- Applicant: Hideo Nagai
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Priority: JP2003-305402 20030828; JP2003-340020 20030930; JP2004-026851 20040203
- International Application: PCT/JP2004/011713 WO 20040809
- International Announcement: WO2005/022654 WO 20050310
- Main IPC: H01L29/201
- IPC: H01L29/201 ; H01L29/205 ; H01L29/207 ; H01L29/40 ; H01L23/48 ; H01L23/52 ; H01L21/00 ; H01L21/28 ; H01L21/3205 ; H01L21/44
Abstract:
An LED array chip (2), which is one type of a semiconductor light emitting device, includes an array of LEDs (6), a base substrate (4) supporting the array of the LEDs (6), and a phosphor film (48). The array of LEDs (6) is formed by dividing a multilayer epitaxial structure including a light emitting layer into a plurality of portions. The phosphor film (48) covers an upper surface of the array of the LEDs (6) and a part of every side surface of the array of LEDs (6). Here, the part extends from the upper surface to the light emitting layer.
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